Structural health monitoring of solder joints in QFN package

I. Gershman, J.B. Bernstein
  • Microelectronics Reliability, December 2012, Elsevier
  • DOI: 10.1016/j.microrel.2012.07.001

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication

The following have contributed to this page: Joseph Bernstein