A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

  • Mostafa Said, Ahmed Shalaby, Farhad Mehdipour, Morteza Biglari-Abhari, Mohamed El-Sayed
  • Microprocessors and Microsystems, June 2016, Elsevier
  • DOI: 10.1016/j.micpro.2016.01.011

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http://dx.doi.org/10.1016/j.micpro.2016.01.011