Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Parisa Bayat, Dietmar Vogel, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R.T. Zahn, Sven Rzepka, Bernd Michel
  • Microelectronic Engineering, April 2015, Elsevier
  • DOI: 10.1016/j.mee.2015.02.004
The author haven't finished explaining this publicationThe author haven't finished explaining this publication
Read Publication

http://dx.doi.org/10.1016/j.mee.2015.02.004

The following have contributed to this page: Professor Dietrich RT Zahn