Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Parisa Bayat, Dietmar Vogel, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R.T. Zahn, Sven Rzepka, Bernd Michel
  • Microelectronic Engineering, April 2015, Elsevier
  • DOI: 10.1016/j.mee.2015.02.004

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The following have contributed to this page: Professor Dietrich RT Zahn