Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications

Marcel Melzer, Thomas Waechtler, Steve Müller, Holger Fiedler, Sascha Hermann, Raul D. Rodriguez, Alexander Villabona, Andrea Sendzik, Robert Mothes, Stefan E. Schulz, Dietrich R.T. Zahn, Michael Hietschold, Heinrich Lang, Thomas Gessner
  • Microelectronic Engineering, July 2013, Elsevier
  • DOI: 10.1016/j.mee.2012.10.026

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http://dx.doi.org/10.1016/j.mee.2012.10.026

The following have contributed to this page: Professor Dietrich RT Zahn