Scaling down thickness of ULK materials for 65nm node and below and its effect on electrical performance

S. Frühauf, C. Himcinschi, M. Rennau, K. Schulze, S.E. Schulz, M. Friedrich, T. Gessner, D.R.T. Zahn, Q.T. Le, R. Caluwaerts
  • Microelectronic Engineering, December 2005, Elsevier
  • DOI: 10.1016/j.mee.2005.07.023

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http://dx.doi.org/10.1016/j.mee.2005.07.023

The following have contributed to this page: Professor Dietrich RT Zahn