Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer

  • A. Elrefaey, W. Tillmann
  • Journal of Materials Processing Technology, March 2009, Elsevier
  • DOI: 10.1016/j.jmatprotec.2008.06.014

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http://dx.doi.org/10.1016/j.jmatprotec.2008.06.014

The following have contributed to this page: Dr Ahmed Elrefaey