Low-k materials for microelectronics interconnects

  • Patrick G. Chiu, David T. Hsu, Hyung-Kun Kim, Frank G. Shi, Hari Singh Nalwa, Bin Zhao
  • January 2001, Elsevier
  • DOI: 10.1016/b978-012513745-4/50041-x

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http://dx.doi.org/10.1016/b978-012513745-4/50041-x