Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites

  • Seunggun Yu, Do-Kyun Kim, Cheolmin Park, Soon Man Hong, Chong Min Koo
  • Research on Chemical Intermediates, November 2013, Springer Science + Business Media
  • DOI: 10.1007/s11164-013-1452-1

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http://dx.doi.org/10.1007/s11164-013-1452-1

The following have contributed to this page: Mr Seunggun Yu