Wafer-level micropackaging in thin film technology for RF MEMS applications

A. Persano, P. Siciliano, F. Quaranta, A. Taurino, A. Lucibello, Romolo Marcelli, G. Capoccia, E. Proietti, A. Bagolini, J. Iannacci
  • Microsystem Technologies, October 2017, Springer Science + Business Media
  • DOI: 10.1007/s00542-017-3583-6

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http://dx.doi.org/10.1007/s00542-017-3583-6

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