First-Principles Simulations of Conditions of Enhanced Adhesion Between Copper and TaN(111) Surfaces Using a Variety of Metallic Glue Materials

Bo Han, Jinping Wu, Chenggang Zhou, Bei Chen, Roy Gordon, Xinjian Lei, David A. Roberts, Hansong Cheng
  • Angewandte Chemie International Edition, November 2009, Wiley
  • DOI: 10.1002/anie.200905360

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http://dx.doi.org/10.1002/anie.200905360

The following have contributed to this page: Professor Hansong Cheng