Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

S. Rudra, T. Wächtler, M. Friedrich, S. J. Louis, C. Himcinschi, S. Zimmermann, S. E. Schulz, S. Silaghi, C. Cobet, N. Esser, T. Gessner, D. R. T. Zahn
  • physica status solidi (a), April 2008, Wiley
  • DOI: 10.1002/pssa.200777831

The authors haven't finished explaining this publication. If you are the author, sign in to claim or explain your work.

Read Publication


The following have contributed to this page: Professor Dietrich RT Zahn