Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

S. Rudra, T. Wächtler, M. Friedrich, S. J. Louis, C. Himcinschi, S. Zimmermann, S. E. Schulz, S. Silaghi, C. Cobet, N. Esser, T. Gessner, D. R. T. Zahn
  • physica status solidi (a), April 2008, Wiley
  • DOI: 10.1002/pssa.200777831
The author haven't finished explaining this publicationThe author haven't finished explaining this publication
Read Publication


The following have contributed to this page: Professor Dietrich RT Zahn