Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

S. Rudra, T. Wächtler, M. Friedrich, S. J. Louis, C. Himcinschi, S. Zimmermann, S. E. Schulz, S. Silaghi, C. Cobet, N. Esser, T. Gessner, D. R. T. Zahn
  • physica status solidi (a), April 2008, Wiley
  • DOI: 10.1002/pssa.200777831

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http://dx.doi.org/10.1002/pssa.200777831

The following have contributed to this page: Professor Dietrich RT Zahn