What is it about?
TSV can be used as a impedance matching element in RF LNA design.
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Why is it important?
TSV can compensate the performance degradation associated with wire-bonding.
Perspectives
This paper will be a good reference for utilizing TSVs in RF circuit design.
Dr Ickhyun Song
Georgia Institute of Technology
Read the Original
This page is a summary of: Advantages of utilizing through-silicon-vias in SiGe HBT RF low-noise amplifier design, Microwave and Optical Technology Letters, August 2015, Wiley,
DOI: 10.1002/mop.29412.
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