A modified quasi-creep model for assessment of deformation of topas COC substrates in the thermal bonding of microfluidic devices: Experiments and modeling

  • Zhi Y. Wang, Chee Y. Yue, Yee C. Lam, Sunanda Roy, Rajeeb K. Jena
  • Journal of Applied Polymer Science, May 2011, Wiley
  • DOI: 10.1002/app.34116

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The following have contributed to this page: Dr Rajeeb Kumar Jena