All Stories

  1. Dense Forsterite Ceramic -just a whisk from a microwave oven!

    Article • Materials Science Forum, August 2016, Trans Tech Publications

    Boon Kar Yap

  2. Effect of Attritor Milling on Synthesis and Sintering of Forsterite Ceramics

    Article • International Journal of Applied Ceramic Technology, May 2016, Wiley

    Boon Kar Yap

  3. Effect of mixed hole transporting host on the mobility, Gaussian density of states and efficiencies of a heterojunction phosphorescent organic light emitting diode

    Article • Journal of Physics D Applied Physics, March 2016, Institute of Physics Publishing

    Boon Kar Yap

  4. Improvement of Insulated Wire Ball Bonding

    Article • January 2016, Springer Science + Business Media

    Boon Kar Yap

  5. Investigations of solution-processed charge generation unit with low concentration of small molecule doped in p-type/HAT-CN6 for tandem OLED

    Article • Journal of Luminescence, January 2016, Elsevier

    Boon Kar Yap

  6. Polymer Solder Balls Robustness under AC & TC Reliability Test

    Article • Applied Mechanics and Materials, September 2015, Trans Tech Publications

    Boon Kar Yap

  7. Rapid Ferritin Iron Release Using FMN Reductase

    Article • International Journal of Bioscience Biochemistry and Bioinformatics, March 2015, International Academy Publishing (IAP)

    Boon Kar Yap

  8. Study on the effects of milling time and sintering temperature on the sinterability of forsterite (Mg2SiO4)

    Article • Journal of the Ceramic Society of Japan, January 2015, Ceramic Society of Japan

    Boon Kar Yap

  9. Sintering studies of synthesised manganese-oxide-doped calcium phosphate via wet chemical precipitation method

    Article • Materials Research Innovations, December 2014, Taylor & Francis

    Boon Kar Yap

  10. Characterisation of insulated Cu wire ball bonding

    Article • Materials Research Innovations, December 2014, Taylor & Francis

    Boon Kar Yap

  11. Stitch bond strength study in insulated Cu wire bonding

    Article • Materials Research Innovations, December 2014, Taylor & Francis

    Boon Kar Yap

  12. Manufacturability readiness of insulated Cu wire bonding process in PBGA package

    Article • December 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  13. Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer

    Article • November 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  14. Characterization study for polymer core solder balls under AC and TC reliability test

    Article • November 2014, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  15. Efficient green phosphorescent tandem organic light emitting diodes with solution processable mixed hosts charge generating layer

    Article • Journal of Luminescence, October 2014, Elsevier

    Boon Kar Yap

  16. Insulated Cu wire free air ball characterization

    Article • Microelectronics Reliability, August 2014, Elsevier

    Boon Kar Yap

  17. The Effects of Calcium-to-Phosphorus Ratio on the Densification and Mechanical Properties of Hydroxyapatite Ceramic

    Article • International Journal of Applied Ceramic Technology, May 2014, Wiley

    Boon Kar Yap

  18. Fine Pitch Wire Bonding with Insulated Cu Wire: Free Air Ball and Ball Bond

    Article • May 2014, Springer Science + Business Media

    Boon Kar Yap

  19. Gel Combustion Synthesis and Characterizations of Nanocrystalline ZnO in Various Dispersants and Mol Ratio

    Article • Applied Mechanics and Materials, December 2013, Trans Tech Publications

    Boon Kar Yap

  20. Enhancement of the work function of indium tin oxide by surface modification using caesium fluoride

    Article • Journal of Physics D Applied Physics, October 2013, Institute of Physics Publishing

    Boon Kar Yap

  21. Sinterability of Forsterite Prepared via Solid-State Reaction

    Article • International Journal of Applied Ceramic Technology, September 2013, Wiley

    Boon Kar Yap

  22. Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

    Article • Microelectronics International, April 2013, Emerald

    Boon Kar Yap

  23. Comparison Study on Shear Strength and Intermetallic Compound for SAC and Polymer Core Solder Balls

    Article • Advanced Science Letters, March 2013, American Scientific Publishers

    Boon Kar Yap

  24. Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

    Article • Microelectronics International, January 2013, Emerald

    Boon Kar Yap

  25. Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

    Article • Microelectronics Reliability, January 2013, Elsevier

    Boon Kar Yap

  26. Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability

    Article • December 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  27. Study on reliability test of die attach material

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  28. Development of insulated Cu wire ball bonding

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  29. Solder ball robustness study on polymer core solder balls for BGA packages

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  30. Effects of Ramp Rates with Short Holding Time on the Sinterability of Hydroxyapatite

    Article • Advanced Materials Research, July 2012, Trans Tech Publications

    Boon Kar Yap

  31. Metallurgical bond integrity of C45 ultra fine pitch with 18μm copper wire

    Article • September 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  32. Improvement of Cu-Al bond integrity on low k pad structures

    Article • September 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  33. Sintering behaviour of forsterite bioceramics

    Article • September 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  34. Process optimization approach in fine pitch Cu wire bonding

    Article • April 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  35. Calcination Effects on the Sinterability of Hydroxyapatite Bioceramics

    Article • January 2011, Springer Science + Business Media

    Boon Kar Yap

  36. The Effect of Ball Milling Hours in the Synthesizing Nano-Crystalline Forsterite via Solid-State Reaction

    Article • January 2011, Springer Science + Business Media

    Boon Kar Yap

  37. Influence of Magnesium Doping in Hydroxyapatite Bioceramics Sintered by Short Holding Time

    Article • January 2011, Springer Science + Business Media

    Boon Kar Yap

  38. Electrical stability of PLEDs

    Article • December 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  39. Charge transport of novel blue dibenzothiophene phenylenediamine copolymer

    Article • December 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  40. Space-Charge-Limited Dark Injection (SCL DI) transient measurements

    Article • June 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  41. Thermal stress test for PLED

    Article • June 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap

  42. Simultaneous optimization of charge-carrier mobility and optical gain in semiconducting polymer films

    Article • Nature Materials, April 2008, Nature

    Boon Kar Yap

  43. Singlet excimer electroluminescence within N,N′-di-1-naphthalenyl-N,N′-diphenyl-[1,1′-biphenyl]-4,4′-diamine based diodes

    Article • Applied Physics Letters, July 2006, American Institute of Physics

    Boon Kar Yap

  44. An automated gravimetric & PWM based fluid dispensing system with GA parameter fine tuning

    Article • February 2000, Institute of Electrical & Electronics Engineers (IEEE)

    Boon Kar Yap