All Stories

  1. Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method
  2. Toward decentralized intelligence in manufacturing: recent trends in automatic identification of things
  3. Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system
  4. Capturing customer judgments of product category
  5. Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method
  6. Selection of the optimal configuration for a flexible surface mount assembly system based on the interrelationships among the flexibility elements
  7. An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly
  8. A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly
  9. Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study
  10. Development of a soldering quality classifier system using a hybrid data mining approach
  11. Improving the fine-pitch stencil printing capability using the Taguchi method and Taguchi fuzzy-based model
  12. MODELING AND OPTIMIZATION OF REFLOW THERMAL PROFILING OPERATION: A COMPARATIVE STUDY
  13. Selection of the optimum promotion mix by integrating a fuzzy linguistic decision model with genetic algorithms
  14. Modeling and optimization of stencil printing operations: A comparison study
  15. A KNOWLEDGE-BASED SYSTEM FOR STENCIL PRINTING PROCESS PLANNING AND CONTROL
  16. Developing a multi-layer reference design retrieval technology for knowledge management in engineering design
  17. A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly
  18. A neuro‐computing approach to the thermal profile control of the second‐side reflow process in surface mount assembly
  19. Neurofuzzy modelling of the reflow thermal profile for surface mount assembly
  20. A neurofuzzy-based quality-control system for fine pitch stencil printing process in surface mount assembly
  21. Modeling and implementation of a neurofuzzy system for surface mount assembly defect prediction and control