All Stories

  1. Investigation of Flux-Less Soldering of Metal Matrix Composite and Ceramics by Use of Zn Solder

    Article • Key Engineering Materials, January 2018, Trans Tech Publications

    prof Roman Kolenak

  2. Effect of in Addition on Microstructure and Properties of Zn-5Al Solder

    Article • Key Engineering Materials, June 2017, Trans Tech Publications

    prof Roman Kolenak

  3. Effect of in Addition to Zn-5Al Solder on Microstructure and Properties of Solder Joints

    Article • Key Engineering Materials, December 2016, Trans Tech Publications

    prof Roman Kolenak

  4. Wettability of Selected Lead-Free Solders for Higher Application Temperatures

    Article • Key Engineering Materials, August 2016, Trans Tech Publications

    prof Roman Kolenak

  5. Influence of Alloying Elements in ZnAl5 Based Alloys on Melting Temperature, Tensile Strength and Vickers Hardness

    Article • Applied Mechanics and Materials, May 2016, Trans Tech Publications

    prof Roman Kolenak

  6. Wettability of Soldering Alloys at Heating by Electron Beam

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    prof Roman Kolenak

  7. ULTRASONIC SOLDERING OF Cu AND Al2O3 CERAMICS BY USE OF Bi-La AND Bi-Ag-La SOLDERS

    Article • Acta Polytechnica, April 2016, Czech Technical University in Prague - Central Library

    prof Roman Kolenak

  8. Research of Wettability of In Solder on Al2O3 Ceramic During Laser Beam Heating

    Article • January 2016, DAAAM International

    prof Roman Kolenak

  9. Investigation of the Influence of Alloying Elements in Zn-Al Alloy on Thermal and Mechanical Properties

    Article • January 2016, DAAAM International

    prof Roman Kolenak

  10. Research of Soldering Silicon Substrate with Solder Type Sn-Ag-Ti

    Article • Applied Mechanics and Materials, January 2015, Trans Tech Publications

    prof Roman Kolenak

  11. Research of Interactions between Al Substrate and Zn-Al Solders

    Article • Procedia Engineering, January 2015, Elsevier

    prof Roman Kolenak

  12. Soldering of Copper with High-temperature Zn-based Solders

    Article • Procedia Engineering, January 2015, Elsevier

    prof Roman Kolenak

  13. Study of Direct Bonding Ceramics with Metal Using Sn2La Solder

    Article • Advances in Materials Science and Engineering, January 2015, Hindawi Publishing Corporation

    prof Roman Kolenak

  14. Research of Fluxless Soldering of High-Purity Aluminium with Solders Type Zn-Al

    Article • Advanced Materials Research, April 2014, Trans Tech Publications

    prof Roman Kolenak

  15. Shear Strength of Joints Fabricated by Solders with High Indium Content

    Article • Materials Science Forum, April 2014, Trans Tech Publications

    prof Roman Kolenak

  16. Research of Joining Graphite by Use of Active Solder

    Article • Advanced Materials Research, February 2014, Trans Tech Publications

    prof Roman Kolenak

  17. Research of Interaction Between Zn Based Solders and Cu, Al Substrates

    Article • Research Papers Faculty of Materials Science and Technology Slovak University of Technology, January 2014, De Gruyter

    prof Roman Kolenak

  18. Research of Joining Brittle Nonmetallic Materials with an Active Solder

    Article • Advances in Materials Science and Engineering, January 2014, Hindawi Publishing Corporation

    prof Roman Kolenak

  19. Determination of Mechanical Properties of Active Solder Alloys Using the Measuring Method “Small Punch Test”

    Article • Key Engineering Materials, September 2013, Trans Tech Publications

    prof Roman Kolenak

  20. Comparison study of SAC405 and SAC405+0.1%Al lead free solders

    Article • Soldering & Surface Mount Technology, June 2013, Emerald

    prof Roman Kolenak

  21. Solderability of Ceramic Materials

    Article • Advanced Science Engineering and Medicine, June 2013, American Scientific Publishers

    prof Roman Kolenak

  22. Characteristics and properties of Bi‐11Ag solder

    Article • Soldering & Surface Mount Technology, April 2013, Emerald

    prof Roman Kolenak

  23. Joining Active Metals with Al2O3 by Use of Solders

    Article • Advanced Materials Research, February 2013, Trans Tech Publications

    prof Roman Kolenak

  24. Research of Joining SiO2 Ceramic Material by Use of Active Solder

    Article • Advanced Science Letters, February 2013, American Scientific Publishers

    prof Roman Kolenak

  25. Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics

    Article • Soldering & Surface Mount Technology, September 2011, Emerald

    prof Roman Kolenak

  26. Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics

    Article • Materials & Design (1980-2015), August 2011, Elsevier

    prof Roman Kolenak

  27. The Study Into the Ceramic-to-Metal Soldered Joints Interface for Al2O3 and SiO2 Materials

    Article • Research Papers Faculty of Materials Science and Technology Slovak University of Technology, January 2010, De Gruyter

    prof Roman Kolenak

  28. The Study Into the Transition Areas of a Soldered Joint of ito Ceramics

    Article • Research Papers Faculty of Materials Science and Technology Slovak University of Technology, January 2010, De Gruyter

    prof Roman Kolenak