All Stories

  1. A variable stiffness strategy for improving comprehensive performances of micromachined electrostatic switches

    Article • Applied Physics Letters, January 2019, American Institute of Physics

    Cheng Ping Cheng, wenguo chen

  2. Patterning Ag film by a facile, efficient and environment-friendly way

    Article • Micro & Nano Letters, September 2016, the Institution of Engineering and Technology (the IET)

    Cheng Ping Cheng

  3. Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

    Article • Journal of Micromechanics and Microengineering, March 2015, Institute of Physics Publishing

    Cheng Ping Cheng

  4. Simultaneous filling of through silicon vias (TSVs) with different aspect ratios using multi-step direct current density

    Article • Journal of Micromechanics and Microengineering, July 2014, Institute of Physics Publishing

    Cheng Ping Cheng

  5. MEMS-based platinum–platinum rhodium film temperature sensor on alumina substrate

    Article • The Journal of Engineering, February 2009, the Institution of Engineering and Technology (the IET)

    Cheng Ping Cheng