All Stories

  1. Directed Self Assembly (DSA) compliant flow with immersion lithography: from material to design and patterning

    Article • March 2016, SPIE

    Joydeep Mitra

  2. Incorporating DSA in multipatterning semiconductor manufacturing technologies

    Article • March 2015, SPIE

    Joydeep Mitra

  3. TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC

    Article • Communications of the ACM, January 2014, ACM (Association for Computing Machinery)

    Joydeep Mitra

  4. TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC

    Article • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, August 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Joydeep Mitra

  5. Design for manufacturability and reliability for TSV-based 3D ICs

    Article • January 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Joydeep Mitra

  6. A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs

    Article • May 2011, Institute of Electrical & Electronics Engineers (IEEE)

    Joydeep Mitra

  7. TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC

    Article • January 2011, ACM (Association for Computing Machinery)

    Joydeep Mitra

  8. Manufacturability-Aware Routing

    Article • November 2008, Taylor & Francis

    Joydeep Mitra

  9. RADAR

    Article • January 2005, ACM (Association for Computing Machinery)

    Joydeep Mitra