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  1. Wafer-level Cu–Sn micro-joints with high mechanical strength and low Sn overflow

    Article • Journal of Micromechanics and Microengineering, August 2015, Institute of Physics Publishing

    Kaiying Wang

  2. Electrochemical engineering of hollow nanoarchitectures: pulse/step anodization (Si, Al, Ti) and their applications

    Article • Chemical Society Reviews, January 2014, Royal Society of Chemistry

    Kaiying Wang