
Mr Tsuyoshi Horikawa
Current affiliation: AIST
Subject: Engineering & Technology
Primary location: Japan
High-density optical interconnects by using silicon photonics
Published in:Next-Generation Optical Networks for Data Centers and Short-Reach Links
Publication date:2014-02-19
Athermal silicon optical interposers operating up to 125° C
Published in:Next-Generation Optical Networks for Data Centers and Short-Reach Links II
Publication date:2015-03-09
Low-loss silicon wire waveguides for optical integrated circuits
Published in:MRS Communications
Publication date:2016-01-06
Mechanisms of Synchrotron X-Ray Irradiation-Induced Damage in (Ba,Sr)TiO3 Capacitors
Published in:Extended Abstracts of the 1997 International Conference on Solid State Devices and Materials
Publication date:1997-01-01
Novel stacked capacitor technology for 1‐Gbit DRAMs with (Ba,Sr)TiO3 thin films
Published in:Electronics and Communications in Japan (Part II Electronics)
Publication date:1997-05-01
Chemical Vapor Deposition Technology of (Ba,Sr)TiO3 Thin Films for Gbit-Scale Dynamic Random Access Memories
Published in:MRS Proceedings
Publication date:1998-01-01
Conformal Step Coverage of (Ba, Sr)TiO3 Films Prepared by Liquid Source CVD Using Ti(t-BuO)2(DPM)2
Published in:Extended Abstracts of the 1998 International Conference on Solid State Devices and Materials
Publication date:1998-01-01
Novel stacked capacitor technology for 1-Gbit DRAMs with (Ba,Sr)TiO3 thin films
Published in:Electronics and Communications in Japan (Part II Electronics)
Publication date:1997-05-01
General graph-theoritical formula for the London susceptibility of a cyclic conjugated system with highly degenerate orbitals
Published in:Chemical Physics Letters
Publication date:1983-03-01
Contribution of quadruply degenerate .PI.-electron orbitals to London susceptibility.
Published in:Bulletin of the Chemical Society of Japan
Publication date:1983-01-01
Photonics-Electronics Convergent System Technology
Published in:Advanced Photonics 2013
Publication date:2013-01-01
Photonics-Electronics Convergence System for High Density Inter-Chip Interconnects by Using Silicon Photonics
Published in:2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)
Publication date:2012-10-01
High Density Optical Interconnects Integrated with Lasers, Optical Modulators and Photodetectors on a Single Silicon Chip
Published in:Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2013
Publication date:2013-01-01
Fully Integrated Silicon Optical Interposers with High Bandwidth Density
Published in:Advanced Photonics for Communications
Publication date:2014-01-01
High-density Silicon Optical Interposer for Inter-chip Interconnects based on Compact and High Speed Components
Published in:CLEO: 2013
Publication date:2013-01-01
Demonstration of over 1000-Channel Hybrid Integrated Light Source for Ultra-High Bandwidth Interchip Optical Interconnection
Published in:Optical Fiber Communication Conference
Publication date:2014-01-01
Multi-channel and high-density hybrid integrated light source by thermal management for low power consumption for ultra-high bandwidth optical inte...
Published in:2014 International Conference on Electronics Packaging (ICEP)
Publication date:2014-04-01
Large-scale silicon photonics integrated circuits for interconnect and telecom applications
Published in:10th International Conference on Group IV Photonics
Publication date:2013-08-01
Advances in High-Density Inter-Chip Interconnects with Photonic Wiring
Published in:IEICE Transactions on Electronics
Publication date:2013-01-01
High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]
Published in:Photonics Research
Publication date:2014-04-11
First demonstration of a hybrid integrated light source on a Si platform using a quantum dot laser under wide temperature range
Published in:2013 IEEE Photonics Conference
Publication date:2013-09-01
First Demonstration of Athermal Silicon Optical Interposers With Quantum Dot Lasers Operating up to 125 °C
Published in:Journal of Lightwave Technology
Publication date:2015-03-15
First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate
Published in:Optics Express
Publication date:2011-11-17
Ultra-fme Si photonics fabrication technology based on 40-nm-node CMOS process
Published in:2015 IEEE 12th International Conference on Group IV Photonics (GFP)
Publication date:2015-08-01
A 300mm Si photonics platform for multi-applications
Published in:2015 Opto-Electronics and Communications Conference (OECC)
Publication date:2015-06-01
High-performance optical waveguide devices using 300mm Si photonics platform
Published in:Microelectronic Engineering
Publication date:2016-04-01
The impacts of fabrication error in Si wire-waveguides on spectral variation of coupled resonator optical waveguides
Published in:Microelectronic Engineering
Publication date:2016-04-01
A 300mm Si photonics platform for optical interconnection
Published in:2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)
Publication date:2015-05-01
Dielectric Properties of ( B a x S r 1- x ) T i O 3 Thin Films Prepared by RF Sputtering for Dynamic Random Access Memory Application
Published in:Japanese Journal of Applied Physics
Publication date:1994-09-30
スパッタリング法により作製した(BaxSr1−x)TiO3薄膜の誘電特性
Published in:Hyomen Kagaku
Publication date:1996-01-01
Dielectric Properties of (Ba, Sr)TiO 3 Thin Films Deposited by RF Sputtering
Published in:Japanese Journal of Applied Physics
Publication date:1993-09-30
Electrical Characterization of 3C-SiC Lateral MOSFETs Fabricated on Heteroepitaxial Films Including High Density of Defects
Published in:Materials Science Forum
Publication date:2015-06-01
Hydrogenated amorphous silicon waveguide with vertical pin structure for infrared detection
Published in:Electronics Letters
Publication date:2016-09-29