All Stories

  1. Hydrogenated amorphous silicon waveguide with vertical pin structure for infrared detection
  2. High-performance optical waveguide devices using 300mm Si photonics platform
  3. The impacts of fabrication error in Si wire-waveguides on spectral variation of coupled resonator optical waveguides
  4. Low-loss silicon wire waveguides for optical integrated circuits
  5. Ultra-fme Si photonics fabrication technology based on 40-nm-node CMOS process
  6. A 300mm Si photonics platform for multi-applications
  7. Electrical Characterization of 3C-SiC Lateral MOSFETs Fabricated on Heteroepitaxial Films Including High Density of Defects
  8. A 300mm Si photonics platform for optical interconnection
  9. First Demonstration of Athermal Silicon Optical Interposers With Quantum Dot Lasers Operating up to 125 °C
  10. Athermal silicon optical interposers operating up to 125° C
  11. High-density and wide-bandwidth optical interconnects with silicon optical interposers [Invited]
  12. Multi-channel and high-density hybrid integrated light source by thermal management for low power consumption for ultra-high bandwidth optical interconnection
  13. High-density optical interconnects by using silicon photonics
  14. Fully Integrated Silicon Optical Interposers with High Bandwidth Density
  15. Demonstration of over 1000-Channel Hybrid Integrated Light Source for Ultra-High Bandwidth Interchip Optical Interconnection
  16. First demonstration of a hybrid integrated light source on a Si platform using a quantum dot laser under wide temperature range
  17. Large-scale silicon photonics integrated circuits for interconnect and telecom applications
  18. Photonics-Electronics Convergent System Technology
  19. High Density Optical Interconnects Integrated with Lasers, Optical Modulators and Photodetectors on a Single Silicon Chip
  20. High-density Silicon Optical Interposer for Inter-chip Interconnects based on Compact and High Speed Components
  21. Advances in High-Density Inter-Chip Interconnects with Photonic Wiring
  22. Photonics-Electronics Convergence System for High Density Inter-Chip Interconnects by Using Silicon Photonics
  23. First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate
  24. Chemical Vapor Deposition Technology of (Ba,Sr)TiO3 Thin Films for Gbit-Scale Dynamic Random Access Memories
  25. Conformal Step Coverage of (Ba, Sr)TiO3 Films Prepared by Liquid Source CVD Using Ti(t-BuO)2(DPM)2
  26. Novel stacked capacitor technology for 1‐Gbit DRAMs with (Ba,Sr)TiO3 thin films
  27. Novel stacked capacitor technology for 1-Gbit DRAMs with (Ba,Sr)TiO3 thin films
  28. Mechanisms of Synchrotron X-Ray Irradiation-Induced Damage in (Ba,Sr)TiO3 Capacitors
  29. スパッタリング法により作製した(BaxSr1−x)TiO3薄膜の誘電特性
  30. Dielectric Properties of ( B a x S r 1- x ) T i O 3 Thin Films Prepared by RF Sputtering for Dynamic Random Access Memory Application
  31. Dielectric Properties of (Ba, Sr)TiO 3 Thin Films Deposited by RF Sputtering
  32. General graph-theoritical formula for the London susceptibility of a cyclic conjugated system with highly degenerate orbitals
  33. Contribution of quadruply degenerate .PI.-electron orbitals to London susceptibility.