All Stories

  1. Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

    Article • Soldering & Surface Mount Technology, April 2017, Emerald

    Dr Yang Liu

  2. Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

    Article • Microelectronics International, January 2017, Emerald

    Dr Yang Liu

  3. High temperature creep properties of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu solder joints by nanoindentation method

    Article • Soldering & Surface Mount Technology, June 2016, Emerald

    Dr Yang Liu

  4. soldering for LED packaging

    Article • Microelectronics International, January 2016, Emerald

    Dr Yang Liu