All Stories

  1. Effect of non-standard SnAg surface finishes on properties of solder joints
  2. Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints
  3. Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys
  4. Graphene-Based UWB Antenna on the Polyimide Substrate
  5. Moisture Absorption of Glass-Epoxy Sandwich Structure
  6. Real-time contact angle’s measurement of molten solder balls in laboratory conditions
  7. Thick Layers’ Adhesion Measurements on Flexible Substrate by Cross Cut Adhesion Test
  8. Wetting of New SnAg Surface Finish
  9. Inkjet-printed HF antenna made on PET substrate
  10. Influence of Various Technologies on the Quality of Ultra-Wideband Antenna on a Polymeric Substrate
  11. Reliability of Embedded SMD Resistors Realized by Face–down Technology
  12. Mechanical properties of sandwich electronic boards after multi reflow exposure
  13. A MEMS Accelerometer Utilization for Viscosity of Technical Oils Sensing
  14. Capacitive Sensors for Saturated Vapour Height Sensing in VPS Soldering
  15. Embedding of Passive SMD Components into the Microvia
  16. Whisker Development from SAC0307-Mn07 Solder Alloy
  17. Properties of glass/epoxy sandwich structure for electronic boards
  18. Measurement and regulation of saturated vapour height level in VPS chamber
  19. Coplanar Capacitive Liquid Level Sensor
  20. Design of Microstrip Antennas for 2.45 GHz on Different Substrates
  21. Dielectric Properties of Substrates for InkJet Technology in GHz Area
  22. Joints realized by sintering of pressureless Ag paste
  23. Investigation of inkjet printed path resistance in the context of manufacture and flexible application
  24. Development and Characterisation of New Biocompatible Sn-Mg Lead-Free Solder
  25. Viscosity Measurement of Silver Based Nano-inks
  26. Improvement of the evaluation of inkjet printed silver based layers’ adhesion
  27. Pressureless Silver Sintering in Power Application
  28. Capacitive touch sensor
  29. Dielectric properties' homogeneity of various substrates in GHz area
  30. Stability of miniaturized non-trimmed thick- and thin-film resistors
  31. Viscosity of Silver Based Nano-Inks
  32. Millimeter-wave Dielectric Resonator Antenna Array Based on Directive LTCC Elements
  33. Influence of various micro channels integrated in LTCC multilayer module on the thermal resistance
  34. Influence of firing profile on microstructural and dielectric properties of LTCC substrates
  35. Dependence of electrical resistivity on sintering conditions of silver layers printed by InkJet printing technology
  36. Design and realisation of planar capacitive proximity sensor based on LTCC using simulation software
  37. Improving thermal resistance of multilayer LTCC module with cooling channels and thermal vias
  38. Possibility of PCBs' miniaturization by using thick film polymer resistors
  39. Investigation of nano-inks’ behaviour on flexible and rigid substrates under various conditions
  40. Real-time profiling of reflow process in VPS chamber
  41. Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt
  42. Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics
  43. Millimeter-wave directive dielectric resonator antenna based on LTCC
  44. LTCC Based Planar Inductive Proximity Sensor Design
  45. Nano-ink Drops’ Behavior on the Polymeric Substrates’ Surfaces
  46. Study of die attachment on DBC substrate
  47. A new approach to construction of extended kit for M-Sequence UWB sensor system based on LTCC
  48. Influence of various multilayer LTCC systems on dielectric properties’ stability in GHz frequency range
  49. Development of planar inductive sensor for proximity sensing based on LTCC
  50. Image processing of die attach's X-ray images for automatic voids detection and evaluation
  51. Influence of accelerating ageing on LTCC and PCB substrates' dielectric properties in GHz area
  52. The impact of surface properties of polymeric substrates on the nano-behavior
  53. Surface analysis of polymeric substrates used for inkjet printing technology
  54. Impact analysis of LTCC materials on microstrip filters’ behaviour up to 13 GHz
  55. Influence of current and combined thermo-current load on microstructure and resistance of solder joints
  56. Measuring of dielectric properties by microstrip resonators in the GHz frequency
  57. Microstrip methods for measurement of dielectric properties in High Frequency area
  58. Modified I - Q Demodulator for m-sequence UWB sensor system based on LTCC
  59. Possibilities of motor oil continuous diagnostics
  60. UWB antenna based on nanoparticles of silver on polyimide substrate
  61. Usability of Various LTCC in Microstrip Filters Construction
  62. Atomic structure of Cu–Zr–Ti metallic glasses subjected to high temperature annealing
  63. Analysis of mechanical properties of LTCC substrates
  64. Influence of different methods of ageing on microstructure of solder joints
  65. Integration of microstrip LP and BP filters to multilayer structure based on various LTCC
  66. Stability of LTCC substrates in high frequency area after accelerated aging tests
  67. Design of microstrip band pass filter based on LTCC for UWB sensor system
  68. Design of narrow-band 2.4 – 2.5 GHz notch filter using various materials
  69. Design of low pass filter for UWB application
  70. Investigation of rheology behavior of solder paste
  71. Reliability testing of lead-free solder joints
  72. Boundary value of rheological properties of solder paste
  73. Perspectives of CAD education at the department of technologies in electronics
  74. Phase evolution of solder alloys
  75. In situ investigation of SnAgCu solder alloy microstructure
  76. Encased manipulation chamber for technologic laboratory
  77. Infrared analysis of temperature distribution on the surface of a populated PCB
  78. Principle of X–ray investigation of solder alloy
  79. HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment
  80. VPS and reliability of solder joint
  81. Analysis of intermetallic compounds in lead-free solders
  82. Vocational training and further education in electronic technology as feasible TQM tool
  83. Electrically conductive adhesive filled with mixture of silver nano and microparticles
  84. Testing of techniques for improvement of conductivity of electrically conductive adhesives
  85. Influence of production technology to reliability of interconnections in the LTCC modules
  86. Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints
  87. Modification of electrically conductive adhesives for better mechanical and electrical properties
  88. Monitoring of the temperature profile of vapour phase reflow soldering
  89. Microstructural Analysis and Transport Properties of RuO2-Based Thick Film Resistors
  90. Optimization of Testing Methods for Investigation of Joints Quality Based on Vapour Phase Lead-free Soldering
  91. Micro-Modular Training System in Electronic Technology - Alternative TQM Tool
  92. Optimisation of Lead Free Solders Reflow Profile
  93. Utilization of Anisotropic Adhesive Joints as an Alternative to Standard SnPb Solder Joints
  94. Electromagnetic Behavior of Inductive Planar Structures with Non-Homogenous Magnetic Environment
  95. RuO2-based Low Temperature Sensors with ?Tuned? Resistivity Dependencies
  96. Bent multilayer LTCC modules for sensor applications
  97. Low temperature micro-calorimeters based on thick film resistors
  98. Thermal shock reliability tests of multilayer LTCC modules with thick film conductors
  99. Stability and reliability of thick film resistors constructed by different techniques
  100. Chosen electrical and reliability properties of thick film photoimageable components
  101. Capacitive button for application in higher humidity environment [position sensors]
  102. Properties and utilization of 3D bent-multilayer hybrid structures
  103. Potentiality of LTCC for sensor applications