All Stories

  1. Study of high speed etching of silicon in KOH + NH2OH Solution at lower temperatures for the fabrication of through holes in silicon wafer

    Article • Micro & Nano Letters, January 2020, the Institution of Engineering and Technology (the IET)

    Dr Prem Pal, P KRISHNA MENON

  2. A systematic study of the etching characteristics of Si{111} in modified TMAH

    Article • Micro & Nano Letters, November 2019, the Institution of Engineering and Technology (the IET)

    Dr Prem Pal, Hiroshi TANAKA

  3. Dynamic analysis of microbeams based on modified strain gradient theory using differential quadrature method

    Article • European Journal of Computational Mechanics, July 2018, Taylor & Francis

    Dr Prem Pal

  4. Effective improvement in the etching characteristics of Si{110} in Low concentration TMAH solution.

    Article • Micro & Nano Letters, April 2018, the Institution of Engineering and Technology (the IET)

    Dr Prem Pal

  5. Investigation of room temperature deposited silicon dioxide thin films for surface texturisation of monocrystalline {100} silicon

    Article • Micro & Nano Letters, January 2016, the Institution of Engineering and Technology (the IET)

    Dr Prem Pal

  6. Anisotropic etching in low-concentration KOH: effects of surfactant concentration

    Article • Micro & Nano Letters, April 2015, the Institution of Engineering and Technology (the IET)

    Dr Prem Pal

  7. Anisotropic etching on Si{1 1 0}: experiment and simulation for the formation of microstructures with convex corners

    Article • Journal of Micromechanics and Microengineering, October 2014, Institute of Physics Publishing

    Dr Prem Pal

  8. A detailed investigation and explanation of the appearance of different undercut profiles in KOH and TMAH

    Article • Journal of Micromechanics and Microengineering, August 2014, Institute of Physics Publishing

    Dr Prem Pal