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  1. Precision stress localization during mechanical harvesting of vertically oriented semiconductor micro- and nanostructure arrays
  2. High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication
  3. Integrating Ormosil films onto microstructured semiconductor substrates
  4. Hierarchical Silver Nanoparticle Micro-Clustering in Poly(methyl methacrylate) Matrix in Spin-Coatable Electrically Conductive Thermoplastics
  5. Seamless Integration of an Elastomer with Electrode Matrix and its In-Situ Conversion into a Solid State Electrolyte for Robust Li-Ion Batteries
  6. Electrically conducting film of silver sub-micron particles as mechanical and electrical interfaces for transfer printed micro- and nano-pillar devices
  7. Electrical Contacts to Vertically Oriented Silicon Nano and Microdevices for Applications in Flexible Systems
  8. Direct Growth of Carbon Nanofibers to Generate a 3D Porous Platform on a Metal Contact to Enable an Oxygen Reduction Reaction
  9. Interfacing Ag Nanoparticles with 1D Semiconductor Micro/Nanostructures via Joule Heating for Transfer Printing Nanodevices at Room Ambient
  10. Electrical Contact Characteristics between Silicon Micropillars and Ag Nanoparticles with Controlled Mechanical Load
  11. Highly Flexible, Transparent and Electrically Conducting Silver Nanoparticles Films Enabled by Controlled Sedimentation
  12. Fracture Transfer of Vertical Semiconductor Pillar Arrays to Low Cost Arbitrary Substrates for Flexible Energy Device Applications
  13. Anisotropic Conducting Film (ACF) of Ag Nanoparticles as Transfer Polymer and Electrical Interface for Silicon Micro- and Nano- Pillars
  14. Conjugated polymers atypically prepared in water
  15. Transfer of micro/nano-scale pillars and wires on conducting thermoplastic composite coated arbitrary substrates
  16. Variable-color poly(3,4-propylenedioxythiophene) electrochromics from precursor polymers