All Stories

  1. Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors
  2. Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers
  3. Study of charge distribution and charge loss in dual-layer metal-nanocrystal-embedded high-κ/SiO2 gate stack
  4. Stress migration risk on electromigration reliability in advanced narrow line copper interconnects
  5. Void dynamics in copper-based interconnects
  6. Defect-induced ferromagnetism on pulsed laser ablated Zn0.95Co0.05O diluted magnetic semiconducting thin films
  7. The effect of stress migration on electromigration in dual damascene copper interconnects