All Stories

  1. Phonon interaction with ripples and defects in thin layered molybdenum disulfide
  2. Analytical methods for the mechanics of graphene bubbles
  3. Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
  4. Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique
  5. Electromechanical phase transition in dielectric elastomers