All Stories

  1. Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

    Article • Journal of Materials Research, April 2015, Cambridge University Press

    Dr Jing-Dong Guo

  2. Microstructure of WC in WC–Co cemented carbides consolidated by electric discharge

    Article • Materials Science and Technology, May 2007, Taylor & Francis

    Dr Jing-Dong Guo