All Stories

  1. Simultaneous Etching and Doping by Cu-Stabilizing Agent for High-Performance Graphene-Based Transparent Electrodes

    Article • Chemistry of Materials, April 2014, American Chemical Society (ACS)

    Dr Seungmin Cho

  2. Fast Synthesis of High-Performance Graphene Films by Hydrogen-Free Rapid Thermal Chemical Vapor Deposition

    Article • ACS Nano, January 2014, American Chemical Society (ACS)

    Dr Seungmin Cho

  3. Highly uniform growth of monolayer graphene by chemical vapor deposition on Cu–Ag alloy catalysts

    Article • Physical Chemistry Chemical Physics, January 2014, Royal Society of Chemistry

    Dr Seungmin Cho

  4. Synthesis of CVD-graphene on rapidly heated copper foils

    Article • Nanoscale, January 2014, Royal Society of Chemistry

    Dr Seungmin Cho

  5. Graphene-induced unusual microstructural evolution in Ag plated Cu foils

    Article • Nanoscale, January 2014, Royal Society of Chemistry

    Dr Seungmin Cho

  6. Wide Field Imaging Analysis of Graphene

    Article • Korean Journal of Optics and Photonics, June 2013, Korean Journal of Optics and Photonics

    Dr Seungmin Cho

  7. Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications

    Article • IEEE Transactions on Advanced Packaging, February 2007, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Seungmin Cho

  8. An Advanced Real-Time Moiré Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

    Article • January 2007, ASME International

    Dr Seungmin Cho

  9. Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

    Article • Journal of Electronic Packaging, January 2004, ASME International

    Dr Seungmin Cho

  10. Thermo-mechanical and flexural behavior of WB-PBGA package using moire interferometry

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Dr Seungmin Cho

  11. Predictive Solder Joint Reliability Assessment of Board-on-Chip Package for DDR-II DRAM Application

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Dr Seungmin Cho

  12. Non-linear Finite Element Analysis for Electronic Packages Subjected to Combined Hygroscopic and Thermo-mechanical Stresses

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Dr Seungmin Cho