All Stories

  1. Development of extremely ductile lead-free Sn-Al solders for futuristic electronic packaging applications
  2. Enhancing Tensile and Compressive Strength of AZ41 Magnesium Alloy by Adding Nano-Sized Al2O3
  3. Improving microstructural and mechanical response of new AZ41 and AZ51 magnesium alloys through simultaneous addition of nano-sized Al2O3 particulates and Ca
  4. Development of high strength Sn-Mg solder alloys with reasonable ductility
  5. Microstructure, thermal and mechanical response of AZ51/Al2O3 nanocomposite with 2wt.% Ca addition
  6. Development of new lead-free Sn-2.5Mg solder for electronic packaging industries
  7. Effect of Ca Addition on the Microstructural and Mechanical Properties of AZ51/1.5 A12O3 Magnesium Nanocomposite
  8. Effect of Nano-Size Al2O3 and Elemental Ca Addition on the Microstructural and Mechanical Properties of AZ41 Magnesium Alloy
  9. Development of new magnesium based alloys and their nanocomposites
  10. Development and Characterization of New AZ41 and AZ51 Magnesium Alloys
  11. Improving mechanical and thermal properties of AZ31 magnesium alloy through simultaneous addition of aluminum and nano-alumina
  12. Effects of sintering and its type on microstructural and tensile response of pure tin