All Stories

  1. Deformation-Induced Residual Stress on Peel Strength

    Article • The Journal of Adhesion, June 2015, Taylor & Francis

    Hadi Noori

  2. Influence of metallic substrate surface engineering on peel resistance of adhesively bonded polymer film

    Article • Journal of Adhesion Science and Technology, April 2015, Taylor & Francis

    Hadi Noori

  3. Significance of Peel Test Speed on Interface Strength in Cohesive Zone Modeling

    Article • The Journal of Adhesion, December 2014, Taylor & Francis

    Hadi Noori

  4. Calculation of forming limit diagrams using Hill's 1993 yield criterion

    Article • International Journal of Mechanical Sciences, April 2011, Elsevier

    Hadi Noori

  5. Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

    Article • Materials Science and Technology, August 2010, Taylor & Francis

    Hadi Noori

  6. Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

    Article • Journal of Electronic Materials, October 2008, Springer Science + Business Media

    Hadi Noori

  7. Impression creep of hypoeutectic Sn–Zn lead-free solder alloys

    Article • Materials Science and Engineering A, September 2008, Elsevier

    Hadi Noori

  8. Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

    Article • Materials Science and Technology, July 2008, Taylor & Francis

    Hadi Noori

  9. A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature

    Article • Journal of Materials Science Materials in Electronics, April 2008, Springer Science + Business Media

    Hadi Noori

  10. Prediction of Forming Limit Diagrams in Sheet Metals Using Different Yield Criteria

    Article • Metallurgical and Materials Transactions A, July 2007, Springer Science + Business Media

    Hadi Noori