All Stories

  1. Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration

    Article • Journal of Materials Research, September 2015, Cambridge University Press

    Professor M.L. Huang

  2. Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration

    Article • Journal of Materials Research, September 2014, Springer Science + Business Media

    Professor M.L. Huang

  3. Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips

    Article • Materials Science and Technology, July 2012, Taylor & Francis

    Professor M.L. Huang