All Stories

  1. Impact of T-gate stem height on parasitic gate delay time in InGaAs-HEMTs
  2. Current collapse suppression in AlGaN/GaN HEMTs by means of slant field plates fabricated by multi-layer SiCN
  3. Improved breakdown voltage and RF characteristics in AlGaN/GaN high-electron-mobility transistors achieved by slant field plates
  4. Impact of T-gate stem height on parasitic gate delay time in InGaAs-HEMTs
  5. Site-Selective Epitaxy of Graphene on Si Wafers
  6. High-Performance Graphene Field-Effect Transistors With Extremely Small Access Length Using Self-Aligned Source and Drain Technique
  7. InGaAs HEMTs with T‐gate electrodes formed by multi‐layer SiCN molds
  8. AlGaN/GaN MIS‐gate HEMTs with SiCN gate stacks
  9. Nonresonant Detection of Terahertz Radiation in High-Electron-Mobility Transistor Structure Using InAlAs/InGaAs/InP Material Systems at Room Temperature
  10. InGaAs HEMTs with T‐gate electrodes fabricated using HMDS SiN mold
  11. Investigation of Graphene Field Effect Transistors with Al 2 O 3 Gate Dielectrics Formed by Metal Oxidation
  12. Room Temperature Logic Inverter on Epitaxial Graphene-on-Silicon Device
  13. Polymer Material as a Gate Dielectric for Graphene Field-Effect-Transistor Applications
  14. Investigation of Graphene Field Effect Transistors with Al 2 O 3 Gate Dielectrics Formed by Metal Oxidation
  15. Room Temperature Logic Inverter on Epitaxial Graphene-on-Silicon Device
  16. Device loading effect on nonresonant detection of terahertz radiation in dual grating gate plasmon‐resonant structure using InGaP/InGaAs/GaAs material systems
  17. Graphene/SiC/Si FETs with SiCN Gate Stack
  18. GaAs- and InP-Based High-Electron-Mobility Transistors
  19. Control of epitaxy of graphene by crystallographic orientation of a Si substrate toward device applications
  20. Impact of T‐gate electrode on gate capacitance in In0.7Ga0.3As HEMTs
  21. Epitaxial graphene top-gate FETs on silicon substrates
  22. Epitaxial graphene field-effect transistors on silicon substrates
  23. Room temperature terahertz detection in high-electron-mobility transistor structure using InAlAs/InGaAs/InP material systems
  24. Ambipolar Behavior in Epitaxial Graphene-Based Field-Effect Transistors on Si Substrate
  25. Extraction of Drain Current and Effective Mobility in Epitaxial Graphene Channel Field-Effect Transistors on SiC Layer Grown on Silicon Substrates
  26. Optoelectronic application of multi-layer epitaxial graphene on a Si substrate
  27. Room Temperature Intense Terahertz Emission from a Dual Grating Gate Plasmon-Resonant Emitter Using InAlAs/InGaAs/InP Material Systems
  28. Epitaxial graphene top-gate FETs on silicon substrates
  29. Terahertz plasmon-resonant microship emitters and their possible sensing and spectroscopic applications
  30. Epitaxial graphene field effect transistors on silicon substrates
  31. Analysis of Fringing Effect on Resonant Plasma Frequency in Plasma Wave Devices
  32. Analysis of Gate Delay Scaling in In 0.7 Ga 0.3 As-Channel High Electron Mobility Transistors
  33. An Optically Clocked Transistor Array for High-Speed Asynchronous Label Swapping: 40 Gb/s and Beyond
  34. Frequency performance of plasmawave devices for THZ applications and the role of fringing effects
  35. Analysis of Intrinsic and Parasitic Gate Delay of InGaAs HEMTs
  36. Ultrafast Optoelectronic Switching of an Optically Clocked Transistor Array
  37. Enhanced Gate Swing in InP HEMTs With High Threshold Voltage by Means of InAlAsSb Barrier
  38. Development of solitons in composite right- and left-handed transmission lines periodically loaded with Schottky varactors
  39. Novel Plasmon-Resonant Terahertz-Wave Emitter Using a Double-Decked HEMT Structure
  40. InP HEMT Technology for High-Speed Logic and Communications
  41. Recent achievements in the reliability of InP-based HEMTs
  42. SAW Filters Composed of Interdigital Schottky and Ohmic Contacts on AlGaN/GaN Heterostructures
  43. Error-free label swapping of asynchronous optical packets with multifunctional optically clocked transistor array
  44. A 40-Gb/s Self-Clocked Bidirectional Serial/Parallel Converter for Asynchronous Label Swapping
  45. All-Optical and Optoelectronic Serial-to-Parallel Conversion of High-Speed, Asynchronous Optical Packets
  46. Label Swapping of an Asynchronous Burst Optical Packet Stream with a Self-Clocked Optically Clocked Transistor Array
  47. Interdigital transducers with control gates on AlGaN∕GaN heterostructures
  48. AlGaN/GaN Field-Effect Surface Acoustic Wave Filters with >40-dB Isolation for Monolithic Integration with HEMTs
  49. Effect of epitaxial layer crystal quality on DC and RF characteristics of AlGaN/GaN short‐gate HEMTs
  50. Dual‐gate AlGaN/GaN high‐electron‐mobility transistors with short gate length for high‐power mixers
  51. 40-Gb/s serial-to-parallel and parallel-to-serial conversion with an optically clocked transistor array
  52. An optically clocked transistor array (OCTA) for 40-Gb/s, bidirectional serial-to-parallel conversion of asynchronous burst optical packets
  53. AlGaN/GaN Dual-Gate HEMT Mixers for 24 GHz Pulse-Modulation
  54. Self-clocked serial-to-parallel and parallel-to-serial conversion with an optically clocked transistor array
  55. Improved stability in wide-recess InP HEMTs by means of a fully passivated two-step-recess gate
  56. Effect of Epitaxial Layer Crystal Quality on DC and RF Characteristics of AlGaN/GaN Short-Gate High-Electron-Mobility Transistors on Sapphire Substrates
  57. Growth of InP high electron mobility transistor structures with Te doping
  58. Hydrogen Sensitivity of InP HEMTs With WSiN-Based Gate Stack
  59. Intrinsic Transit Delay and Effective Electron Velocity of AlGaN/GaN High Electron Mobility Transistors
  60. An Intrinsic Delay Extraction Method for Schottky Gate Field Effect Transistors
  61. Quantum electronics and compound semiconductors HEMTs: physics and now technologies
  62. Correlation between current–voltage characteristics and dislocations evaluated with submicrometer Schottky contacts on n-GaN grown by metalorganic chemical vapor deposition
  63. 30-nm two-step recess gate InP-Based InAlAs/InGaAs HEMTs
  64. Optical study of high-biased AlGaN/GaN high-electron-mobility transistors
  65. Influence of Hole Accumulation on Source Resistance, Kink Effect and On-State Breakdown of InP-Based High Electron Mobility Transistors: Light Irradiation Study
  66. Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs
  67. Electroluminescence characterization of AlGaN/GaN high-electron-mobility transistors
  68. Correlation between current–voltage characteristics and dislocations for n-GaN Schottky contacts
  69. Frequency Dispersion in Drain Conductance of InAlAs/InGaAs Hight-Electron Mobility Transisters (HEMTs) and Its Relationship with Impact Ionization
  70. Parasitic effects and long term stability of InP-based HEMTs
  71. Depletion- and enhancement-mode modulation-doped field-effect transistors for ultrahigh-speed applications: an electrochemical fabrication technology
  72. Optical Characterization of Impact Ionization in Flip-Chip-Bonded InP-Based High Electron Mobility Transistors
  73. Short gate-length InAlAs/InGaAs MODFETs with asymmetry gate-recess grooves: electrochemical fabrication and performance
  74. High-performance 0.1-μm gate enhancement-mode InAlAs/InGaAs HEMT's using two-step recessed gate technology
  75. An 0.03 μm gate-length enhancement-mode InAlAs/InGaAs/InP MODFET's with 300 GHz f/sub T/ and 2 S/mm extrinsic transconductance
  76. Modulation-doped field-effect transistors with an 8-nm InGaAs/InAs/InGaAs quantum well
  77. Highly Stable Device Characteristics of InP-Based Enhancement-Mode High Electron Mobility Transistors with Two-Step-Recessed Gates
  78. High-Resolution Scanning Electron Microscopy Observation of Electrochemical Etching in the Formation of Gate Grooves for InP-Based Modulation-Doped Field-Effect Transistors
  79. 30-nm-Gate InP-Based Lattice-Matched High Electron Mobility Transistors with 350 GHz Cutoff Frequency
  80. Impact of nonlinear drain resistance in bias-stressed InAlAs/InGaAs HEMTs
  81. Self-compensation of short-channel effects in sub-0.1-μm InAlAs/InGaAs MODFETs by electrochemical etching
  82. Electrochemically induced asymmetrical etching in InAlAs/InGaAs heterostructures for MODFET gate-groove fabrication
  83. Improved Recessed-Gate Structure for Sub-0.1-µm-Gate InP-Based High Electron Mobility Transistors
  84. Impact of subchannel design on DC and RF performance of 0.1 [micro sign]m MODFETs with InAs-inserted channel
  85. Improving threshold-voltage uniformity of 0.1 [micro sign]m InP-based MODFETs with different gate layouts
  86. An analysis of the kink phenomena in InAlAs/InGaAs HEMT's using two-dimensional device simulation
  87. Impact of two-step-recessed gate structure on RF performance of InP-based HEMTs
  88. Kink modification using body contact bias in InP based InAlAs/InGaAs HEMTs
  89. Body contacts in InP-based InAlAs/InGaAs HEMTs and their effects on breakdown voltage and kink suppression
  90. Quantum, power and compound semiconductor devices high-speed compound semiconductor devices for logic and communications
  91. Hydrogen sensitivity of InP HEMTs with WSiN-based gate stack
  92. Effective length of high-field region in InGaAs-based lattice-matched HEMTs
  93. Reliability study of parasitic source and drain resistances of InP-based HEMTs
  94. Electrochemical etching in wet-chemical gate recess for InAlAs/InGaAs heterojunction FETs
  95. Mechanism and structural dependence of kink phenomena in InAlAs/InGaAs HEMTs
  96. Enhancement of weak impact ionization in InAlAs/InGaAs HEMTs induced by surface traps: simulation and experiments
  97. 30-nm-gate InAlAs/InGaAs HEMTs lattice-matched to InP substrates
  98. Hydrogen sensitivity of InP HEMTs with a thick Ti-layer in the Ti/Pt/Au gate stack
  99. Study of breakdown dynamics in InAlAs/InGaAs/InP HEMTs with gate length scaling down to 80 nm
  100. Ultrahigh-speed InP-based D- and E-mode MODFETs with ultra-short electrochemically-recessed gate contacts
  101. High-performance 0.1-μm-gate enhancement-mode InAlAs/InGaAs HEMTs using two-step-recessed gate technology
  102. Influence of hole accumulation on the source resistance, kink effect, and on-state breakdown of InP-based HEMTs: light irradiation study