All Stories

  1. Reliability Physics and Engineering: Time-to-Failure Modeling, J. W. McPherson, Springer (2019). III, pp. 463

    Article • Life Cycle Reliability and Safety Engineering, January 2020, Springer Science + Business Media

    Dr Chong Leong Gan

  2. Book review

    Article • Microelectronics Reliability, July 2017, Elsevier

    Dr Chong Leong Gan

  3. Book review

    Article • Microelectronics Reliability, March 2017, Elsevier

    Dr Chong Leong Gan

  4. 3D Flash Memories

    Article • Microelectronics Reliability, October 2016, Elsevier

    Dr Chong Leong Gan

  5. Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

    Article • September 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  6. Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)

    Article • September 2016, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  7. Book Review

    Article • Microelectronics Reliability, August 2016, Elsevier

    Dr Chong Leong Gan

  8. Book Review

    Article • Microelectronics Reliability, April 2016, Elsevier

    Dr Chong Leong Gan

  9. Book review

    Article • Microelectronics Reliability, November 2015, Elsevier

    Dr Chong Leong Gan

  10. Reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds

    Article • October 2015, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  11. Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire

    Article • Microelectronics Reliability, July 2015, Elsevier

    Dr Chong Leong Gan

  12. Book review

    Article • Microelectronics Reliability, April 2015, Elsevier

    Dr Chong Leong Gan

  13. Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

    Article • Journal of Materials Science Materials in Electronics, March 2015, Springer Science + Business Media

    Dr Chong Leong Gan

  14. Influence of shear strength on long term biased humidity reliability of Cu ball bonds

    Article • Journal of Materials Science Materials in Electronics, August 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  15. Overview of gold wire Bonding in semiconductor industry.

    Article • Microelectronics International, April 2014, Emerald

    Dr Chong Leong Gan

  16. Evolution and investigation of copper and gold ball bonds in extended reliability stressing

    Article • Gold Bulletin, March 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  17. Book review

    Article • Microelectronics Reliability, February 2014, Elsevier

    Dr Chong Leong Gan

  18. Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging

    Article • Journal of Electronic Materials, January 2014, Springer Science + Business Media

    Dr Chong Leong Gan

  19. Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    Article • PLoS ONE, January 2014, PLOS

    Dr Chong Leong Gan

  20. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    Article • PLoS ONE, November 2013, PLOS

    Dr Chong Leong Gan

  21. Effects of wire type and mold compound on wearout reliability of semiconductor flash fineline BGA package

    Article • October 2013, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  22. Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

    Article • Microelectronics International, July 2013, Emerald

    Dr Chong Leong Gan

  23. Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging

    Article • Journal of Electronic Packaging, April 2013, ASME International

    Dr Chong Leong Gan

  24. Extended reliability of gold and copper ball bonds in microelectronic packaging

    Article • Gold Bulletin, April 2013, Springer Science + Business Media

    Dr Chong Leong Gan

  25. Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

    Article • Journal of Materials Science Materials in Electronics, March 2013, Springer Science + Business Media

    Dr Chong Leong Gan

  26. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

    Article • Journal of Nanomaterials, January 2013, Hindawi Publishing Corporation

    Dr Chong Leong Gan

  27. Reliability challenges of Cu wire deployment in flash memory packaging

    Article • October 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  28. Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

    Article • October 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  29. Electronic Voting: A Review and Taxonomy

    Article • August 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan

  30. Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging

    Article • Journal of Nanomaterials, January 2012, Hindawi Publishing Corporation

    Dr Chong Leong Gan

  31. Environmental friendly package development by using copper wirebonding

    Article • November 2010, Institute of Electrical & Electronics Engineers (IEEE)

    Dr Chong Leong Gan