Current affiliation: Beijing University of Chemical TechnologySubject: Engineering & TechnologyPrimary location: China, People's Republic of
Published in:Polymer Engineering and SciencePublication date:2016-08-01
Decreasing the cycle time to about 20 seconds by setting a constant mold temperatre in whole cycle of hot embossing.
Published in:2011 International Conference on Electric Information and Control EngineeringPublication date:2011-04-01
Published in:2010 International Conference on Mechanic Automation and Control EngineeringPublication date:2010-06-01
Published in:Polymer Engineering and SciencePublication date:2017-06-28
Published in:Procedia EngineeringPublication date:2011-01-01
Published in:Composites Part A Applied Science and ManufacturingPublication date:2017-11-01
To increase the conductivity of the CPCs after percolation threshold via compressing the free assembled network.
Published in:RSC AdvancesPublication date:2017-01-01
A method to get a more compacted conductive network.
Published in:Polymer TestingPublication date:2017-05-01
rheological behaviors of polymer in micro molding