Primary location: United States
Published in:Philosophical Magazine LettersPublication date:2016-03-03
Based on the well-accepted physical understanding that cleavage
fracture of structural steels is preceded by plastic deformation, a critical
Published in:Philosophical MagazinePublication date:2016-09-25
The well established consensus that cleavage fracture is preceded by
plastic deformation in structural steels implies that plastic yielding
is the ...
Published in:Mittal/AdhesionPublication date:2014-09-12
Published in:Mechanics of MaterialsPublication date:2016-02-01
The fundamental physical assumption of plastic deformation as a prerequisite to the cleavage fracture event demands to rule out the contribution of...
Published in:Medical Coatings and Deposition TechnologiesPublication date:2016-08-08
Published in:Mechanics of MaterialsPublication date:2016-10-01
The prevailing statistical models of cleavage fracture of structural steels for probabilistic risk assessment all infer a two- or three- parameter ...
Published in:Materials Chemistry and PhysicsPublication date:1996-10-01
Published in:Theoretical and Applied Fracture MechanicsPublication date:2016-10-01
Microcracks distribute randomly in a solid with respect to their size, shape, spatial location and orientation. This makes it attractive from the a...
Published in:Engineering Fracture MechanicsPublication date:1996-03-01
Published in:Engineering Fracture MechanicsPublication date:1993-11-01
Published in:Engineering Fracture MechanicsPublication date:2016-03-01
Ruggieri et al. (2015) proposed a modified Weibull stress model incorporating plastic strain effect and employed it in combination with the distrib...
Published in:2005 6th International Conference on Electronic Packaging TechnologyPublication date:Not available
Published in:Scripta Metallurgica et MaterialiaPublication date:1994-07-01
Published in:Lasers in Material Processing and Manufacturing IIPublication date:2005-01-13
Published in:Journal of Engineering Materials and TechnologyPublication date:1994-01-01
Published in:Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and PhenomenaPublication date:2012-01-01
Die singulation, also known as wafer dicing, is reviewed in terms of the brief history, critical challenges, characterization of singulation qualit...