All Stories

  1. Probabilistic Fitts’ Law with Application to Spacecraft Collision with an Asteroid
  2. Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
  3. Aerospace electronics reliability prediction: application of two advanced probabilistic techniques
  4. Aerospace electronics-and-photonics (AEP) reliability has to be quantified to be assured
  5. Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress?
  6. Human-in-the-loop: probabilistic predictive modelling, its role, attributes, challenges and applications
  7. Probabilistic modelling of the concept of anticipation in aviation
  8. Minimizing thermally induced interfacial shearing stress in a thermoelectric module with low fractional area coverage
  9. Predictive reliability using FEA simulations of power stacked ceramic capacitors for aeronautical applications
  10. Analysis of a Prestressed Bi-Material Accelerated-Life-Test (ALT) Specimen
  11. Manned missions to Mars: Minimizing risks of failure
  12. Fiber optics engineering: Physical design for reliability
  13. Photovoltaic reliability engineering: quantification testing and probabilistic-design-reliability concept
  14. Could electronics reliability be predicted, quantified and assured?
  15. Thermal Stress Failures in Electronics and Photonics: Physics, Modeling, Prevention
  16. Effect of processing factors on dielectric properties of BaTiO3/hyperbranched polyester core-shell nanoparticles
  17. Buckling conditions for a dual-coated optical fiber
  18. Assuring Electronics Reliability: What Could and Should Be Done Differently
  19. Design-for-reliability (DfR) of aerospace electronics: Attributes and challenges
  20. Predicted reliability of aerospace electronics: Application of two advanced probabilistic concepts
  21. Predicted size of the inelastic zone in a ball-grid-array (BGA) assembly
  22. Reliability of objects in aerospace technologies and beyond: Holistic risk management approach
  23. 'Miracle-on-the-Hudson': quantitative aftermath
  24. Novel core-shell nanocomposites for RF embedded capacitors: Processing and characterization
  25. Transient thermomechanical study of a thick-wire bond with particular attention to the interfacial shearing stress
  26. Deformations in stretched surface mounted ceramic strips for sensor applications
  27. Two Men in a Cockpit: Casualty Likelihood if One Pilot Becomes Incapacitated
  28. Random Vibrations of Structural Elements in Electronic and Photonic Systems
  29. Linear and Nonlinear Vibrations Caused by Periodic Impulses
  30. Linear Response to Shocks and Vibrations
  31. Structural Dynamics of Electronic and Photonic Systems
  32. Linear Response of Single‐Degree‐of‐Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?
  33. Dynamic Response of PCB Structures to Shock Loading in Reliability Tests
  34. Shock Test Methods and Test Standards for Portable Electronic Devices
  35. Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse?
  36. Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW)
  37. Two Men in a Cockpit: Probabilistic Assessment of the Likelihood of a Casualty if One of the Two Navigators Becomes Incapacitated
  38. Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components
  39. Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)
  40. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
  41. Modeling of thermal phenomena in a high power diode laser package
  42. Tailored polymer–metal fractal nanocomposites: an approach to highly active surface enhanced Raman scattering substrates
  43. Helicopter Landing Ship (HLS): Undercarriage Strength and the Role of the Human Factor
  44. On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?
  45. Compliance properties study of carbon nanofibres (CNFs) array as thermal interface material
  46. Disc-like copper vias fabricated in a silicon wafer: Design for reliability
  47. Portable 2008 - Second ieee international interdisciplinary intersociety conference on pids
  48. Reliability improvement through nanoparticle material-based fiber structures
  49. Publisher's Note: “Thermal properties of carbon nanotube array used for integrated circuit cooling” [J. Appl. Phys. 100, 074302 (2006)]
  50. Effect of rapid thermal annealing (RTA) on thermal properties of carbon nanofibre (CNF) arrays
  51. Effective Young's modulus of carbon nanofiber array
  52. Bonding strength of a carbon nanofiber array to its substrate
  53. Thermal properties of carbon nanotube array used for integrated circuit cooling
  54. Accelerated life testing in photonics packaging: its objectives, role, attributes, challenges, pitfalls, predictive models, and interaction with other accelerated stress categories
  55. Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests
  56. Editor’s Note
  57. Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board
  58. Applied Probability for Engineers and Scientists
  59. Reliability of Photonics Materials and Structures (Proceedings of the Reliability of Photonics Materials and Structures Symposium held April 13–16, 1998 in San Francisco, CA)
  60. Fiber Optics Structural Mechanics: Brief Review
  61. Applied Probability for Engineers and Scientists
  62. Pull testing of a glass fiber soldered into a ferrule: how long should the test specimen be?
  63. Input/output fiber configuration in a laser package design: optimization for lower stresses
  64. Stresses in a coated fiber stretched on a capstan
  65. Buffering effect of fiber coating and its influence on the proof test load in optical fibers
  66. Editorial
  67. Bending performance of clamped optical fibers: stresses due to the end off-set
  68. ”Automatized” Peel Testing: Calculated Stresses and Deflections in the Film
  69. “Automatized” Peel Testing: Calculated Stresses and Deflections in the Film
  70. New approach to the high quality epitaxial growth of lattice-mismatched materials
  71. Dynamic Physical Reliability in Application to Photonic Materials
  72. Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems