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  1. Material Removal Model of Lap Grinding for Sapphire Substrate Based on Roughness Parameters

    Article • Materials Science Forum, March 2017, Trans Tech Publications

    Professor Hyunseop Lee

  2. Effect of Citric Acid in Chemical Mechanical Polishing (CMP) for Lithium Tantalate (LiTaO3) Wafer

    Article • Advanced Materials Research, January 2016, Trans Tech Publications

    Professor Hyunseop Lee