Current affiliation: SEGi University Kota DamansaraSubject: Materials SciencePrimary location: Malaysia
Published in:Soldering and Surface Mount TechnologyPublication date:2013-09-13
Published in:Soldering and Surface Mount TechnologyPublication date:2014-05-27
Published in:MATEC Web of ConferencesPublication date:2015-01-01
Published in:2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)Publication date:2012-11-01
Published in:Advanced Materials ResearchPublication date:2013-12-01
As the electronic packaging industry is vastly being developed, the solder plays a crucial role in providing integrity electronic assemblies. Unfor...
Published in:IOP Conference Series Materials Science and EngineeringPublication date:2017-06-01
This work studies the melting temperature, wettability, metallurgical and hardness properties of the Sn-58Bi (SB) lead-free solder alloy incorporat...