All Stories

  1. Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint

    Article • MATEC Web of Conferences, January 2018, EDP Sciences

    Mr Amares Singh

  2. Influence of Nano-3%Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy

    Article • IOP Conference Series Materials Science and Engineering, June 2017, Institute of Physics Publishing

    Mr Amares Singh

  3. A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

    Article • MATEC Web of Conferences, January 2015, EDP Sciences

    Mr Amares Singh, Mr Amares Singh

  4. Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

    Article • Soldering & Surface Mount Technology, May 2014, Emerald

    Mr Amares Singh, Mr Amares Singh

  5. Characterizations of Physical Properties of Sn-Bi Solder Alloy

    Article • Advanced Materials Research, December 2013, Trans Tech Publications

    Mr Amares Singh, Mr Amares Singh

  6. A review: influence of nano particles reinforced on solder alloy

    Article • Soldering & Surface Mount Technology, September 2013, Emerald

    Mr Amares Singh, Mr Amares Singh

  7. Characterization of mechanical testing on lead free solder on electronic application

    Article • November 2012, Institute of Electrical & Electronics Engineers (IEEE)

    Mr Amares Singh, Mr Amares Singh