All Stories

  1. SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

    Article • Soldering & Surface Mount Technology, February 2018, Emerald

    Associate Prof. Dr Norinsan Kamil Othman, Prof Azman Jalar, Fakhrozi Che Ani

  2. Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

    Article • Soldering & Surface Mount Technology, April 2017, Emerald

    Prof Azman Jalar

  3. The Relationship between XRD Peak Intensity and Mechanical Properties of Irradiated Lead-Free Solder

    Article • Materials Science Forum, March 2017, Trans Tech Publications

    Prof Azman Jalar, Associate Prof. Dr Norinsan Kamil Othman, maria abu bakar, Wilfred Paulus

  4. Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

    Article • Key Engineering Materials, July 2016, Trans Tech Publications

    Prof Azman Jalar, Associate Prof. Dr Norinsan Kamil Othman

  5. Study of the side gate junctionless transistor in accumulation region

    Article • Microelectronics International, May 2016, Emerald

    Dr P Susthitha Menon, Prof Azman Jalar, Dr Arash Dehzangi

  6. Nanoindentation Study on Heat Treated Gold Wire Bonding

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar, Associate Prof. Dr Norinsan Kamil Othman

  7. Directional Growth Behaviour of Intermetallic Compound of Sn3.0Ag0.5Cu/ImSn Subjected to Thermal Cycling

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar, maria abu bakar

  8. Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar, maria abu bakar

  9. Surface Roughness and Wettability of SAC/CNT Lead Free Solder

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar, MRS NORLIZA ISMAIL

  10. Wettability of CNT-Doped Solder under Isothermal Aging

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar, MRS NORLIZA ISMAIL

  11. Mechanical Interlocking on Leadframe Surface for Bondability of Au Wedge Bond

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar

  12. Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond

    Article • Materials Science Forum, May 2016, Trans Tech Publications

    Prof Azman Jalar

  13. Electrochemical Migration Behaviours of Low Silver Content Solder Alloy SAC 0307 on Printed Circuit Boards (PCBs) in NaCl Solution

    Article • Materials Science Forum, March 2016, Trans Tech Publications

    Associate Prof. Dr Norinsan Kamil Othman, Prof Azman Jalar, Zambri Samsudin

  14. The influence of temperature on the inhibition of carbon steel corrosion in acidic lignin

    Article • Anti-Corrosion Methods and Materials, September 2015, Emerald

    Associate Prof. Dr Norinsan Kamil Othman, Prof Azman Jalar

  15. High Temperature Corrosion With Corrosive environment

    Article • Advanced Materials Research, June 2015, Trans Tech Publications

    Associate Prof. Dr Norinsan Kamil Othman, Prof Azman Jalar

  16. Effect of wire diameter and hook location on second bond failure modes

    Article • Microelectronics International, January 2015, Emerald

    Prof Azman Jalar