All Stories

  1. Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

    Article • Circuit World, August 2016, Emerald

    Dr Yuanming Chen

  2. Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

    Article • Circuit World, May 2015, Emerald

    Dr Yuanming Chen, Professor Vadim V Silberschmidt

  3. Effects of surface-functionalized aluminum nitride on thermal, electrical, and mechanical behaviors of polyarylene ether nitrile-based composites

    Article • Polymer Composites, April 2015, Wiley

    Dr Yuanming Chen, Professor Vadim V Silberschmidt

  4. Properties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplates

    Article • Journal of Applied Polymer Science, January 2015, Wiley

    Dr Yuanming Chen, Professor Vadim V Silberschmidt

  5. UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB

    Article • Circuit World, July 2014, Emerald

    Dr Yuanming Chen

  6. Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

    Article • Polymer International, July 2013, Wiley

    Dr Yuanming Chen