All Stories

  1. Graphite: Hardware-Aware GNN Reshaping for Acceleration With GPU Tensor Cores

    Article • IEEE Transactions on Parallel and Distributed Systems, May 2025, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  2. RoTA: Rotational Torus Accelerator for Wear Leveling of Neural Processing Elements

    Article • March 2025, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  3. Genie Cache: Non-Blocking Miss Handling and Replacement in Page-Table-Based DRAM Cache

    Article • November 2024, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  4. Nona: Accurate Power Prediction Model Using Neural Networks

    Article • June 2024, ACM (Association for Computing Machinery)

    William Song, HoSun Choi

  5. NeuroSpector: Systematic Optimization of Dataflow Scheduling in DNN Accelerators

    Article • IEEE Transactions on Parallel and Distributed Systems, August 2023, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  6. LAS: Locality-Aware Scheduling for GEMM-Accelerated Convolutions in GPUs

    Article • IEEE Transactions on Parallel and Distributed Systems, May 2023, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  7. NOMAD: Enabling Non-blocking OS-managed DRAM Cache via Tag-Data Decoupling

    Article • February 2023, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  8. SnakeByte: A TLB Design with Adaptive and Recursive Page Merging in GPUs

    Article • February 2023, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  9. The Nebula Benchmark Suite: Implications of Lightweight Neural Networks

    Article • IEEE Transactions on Computers, November 2021, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  10. Thread-Aware Area-Efficient High-Level Synthesis Compiler for Embedded Devices

    Article • February 2021, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  11. Hardware accelerator systems for embedded systems

    Article • January 2021, Elsevier

    William Song

  12. Duplo: Lifting Redundant Memory Accesses of Deep Neural Networks for GPU Tensor Cores

    Article • October 2020, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  13. Energy-Efficient Acceleration of Deep Neural Networks on Realtime-Constrained Embedded Edge Devices

    Article • IEEE Access, January 2020, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  14. FineReg: Fine-Grained Register File Management for Augmenting GPU Throughput

    Article • October 2018, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  15. Processor heterogeneity options for power-performance efficiency

    Article • August 2016, ACM (Association for Computing Machinery)

    William Song

  16. Reliability-performance tradeoffs between 2.5D and 3D-stacked DRAM processors

    Article • April 2016, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  17. Amdahl's law for lifetime reliability scaling in heterogeneous multicore processors

    Article • March 2016, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  18. KitFox: Multiphysics Libraries for Integrated Power, Thermal, and Reliability Simulations of Multicore Microarchitecture

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, November 2015, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  19. Temperature regulation in multicore processors using adjustable-gain integral controllers

    Article • September 2015, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  20. Architectural Reliability: Lifetime Reliability Characterization and Management ofMany-Core Processors

    Article • IEEE Computer Architecture Letters, July 2015, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  21. Managing performance-reliability tradeoffs in multicore processors

    Article • April 2015, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  22. Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices

    Article • IEEE Transactions on Very Large Scale Integration (VLSI) Systems, September 2014, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  23. Power Modeling for GPU Architectures Using McPAT

    Article • ACM Transactions on Design Automation of Electronic Systems, June 2014, ACM (Association for Computing Machinery)

    William Song

  24. Energy Introspector: A parallel, composable framework for integrated power-reliability-thermal modeling for multicore architectures

    Article • March 2014, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  25. Manifold: A parallel simulation framework for multicore systems

    Article • March 2014, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  26. Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification

    Article • IEEE Transactions on Components Packaging and Manufacturing Technology, January 2014, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  27. Enhancements to FPMIPv6 for improved seamless vertical handover between LTE and heterogeneous access networks

    Article • IEEE Wireless Communications, June 2013, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  28. Throughput regulation in multicore processors via IPA

    Article • December 2012, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  29. A power capping controller for multicore processors

    Article • June 2012, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  30. Thermal system identification (TSI): A methodology for post-silicon characterization and prediction of the transient thermal field in multicore chips

    Article • March 2012, Institute of Electrical & Electronics Engineers (IEEE)

    William Song

  31. SST: A Scalable Parallel Framework for Architecture-Level Performance, Power, Area and Thermal Simulation

    Article • The Computer Journal, July 2011, Oxford University Press (OUP)

    William Song

  32. A framework for architecture-level power, area, and thermal simulation and its application to network-on-chip design exploration

    Article • ACM SIGMETRICS Performance Evaluation Review, March 2011, ACM (Association for Computing Machinery)

    William Song

  33. Improvements to seamless vertical handover between mobile WiMAX and 3GPP UTRAN through the evolved packet core

    Article • IEEE Communications Magazine, April 2009, Institute of Electrical & Electronics Engineers (IEEE)

    William Song