All Stories

  1. A statistical model of fatigue failure incorporating effects of specimen size and load amplitude on fatigue life

    Article • The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, May 2019, Taylor & Francis

    Wei-Sheng Lei

  2. On the temperature independence of statistical model parameters for cleavage fracture in ferritic steels

    Article • The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, February 2018, Taylor & Francis

    Wei-Sheng Lei

  3. A new local approach model for cleavage fracture in ferritic steels and its validation

    Article • MATEC Web of Conferences, January 2018, EDP Sciences

    Wei-Sheng Lei

  4. On the statistical modeling of cleavage fracture toughness of structural steels

    Article • Mechanics of Materials, October 2016, Elsevier

    Wei-Sheng Lei

  5. Fracture probability of a randomly oriented microcrack under multi-axial loading for the normal tensile stress criterion

    Article • Theoretical and Applied Fracture Mechanics, October 2016, Elsevier

    Wei-Sheng Lei

  6. A framework for statistical modelling of plastic yielding initiated cleavage fracture of structural steels

    Article • The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, September 2016, Taylor & Francis

    Wei-Sheng Lei

  7. Adhesion Measurement of Thin Films and Coatings: Relevance to Biomedical Applications

    Article • August 2016, Wiley

    Wei-Sheng Lei

  8. A statistical model of cleavage fracture in structural steels with power-law distribution of microcrack size

    Article • Philosophical Magazine Letters, March 2016, Taylor & Francis

    Wei-Sheng Lei

  9. A discussion of “An engineering methodology for constraint corrections of elastic–plastic fracture toughness – Part II: Effects of specimen geometry and plastic strain on cleavage fracture predictions” by C. Ruggieri, R.G. Savioli, R.H. Dodds [Eng. Fra...

    Article • Engineering Fracture Mechanics, March 2016, Elsevier

    Wei-Sheng Lei

  10. A cumulative failure probability model for cleavage fracture in ferritic steels

    Article • Mechanics of Materials, February 2016, Elsevier

    Wei-Sheng Lei

  11. Delamination and Reliability Issues in Packaged Devices

    Article • September 2014, Wiley

    Wei-Sheng Lei

  12. Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.

    Article • September 2014, Wiley

    Wei-Sheng Lei

  13. Die singulation technologies for advanced packaging: A critical review

    Article • Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena, January 2012, American Vacuum Society

    Wei-Sheng Lei

  14. Solid state UV laser technology for electronic packaging applications

    Article • January 2005, SPIE

    Wei-Sheng Lei

  15. Cleavage characteristic stress Sc0: a new parameter of microscopic resistance to cleavage fracture

    Article • Materials Chemistry and Physics, October 1996, Elsevier

    Wei-Sheng Lei

  16. Quantitative description of temperature- and strain rate-dependence of yield strength of structural steels

    Article • Engineering Fracture Mechanics, March 1996, Elsevier

    Wei-Sheng Lei

  17. Experimental verification of cleavage characteristic stress vs grain size

    Article • Scripta Metallurgica et Materialia, July 1994, Elsevier

    Wei-Sheng Lei

  18. Fatigue Growth Analysis of an Inclined Crack Under Uniaxial Cyclic Loading in Materials With Different Yield Strengths in Tension and Compression

    Article • Journal of Engineering Materials and Technology, January 1994, ASME International

    Wei-Sheng Lei

  19. Numerical analysis of strain rate field below notch root of Charpy V-notch test specimen under impact loading condition

    Article • Engineering Fracture Mechanics, November 1993, Elsevier

    Wei-Sheng Lei

  20. UV Laser Solutions for Electronic Interconnect and Packaging

    Article • Institute of Electrical & Electronics Engineers (IEEE)

    Wei-Sheng Lei