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  1. Physics-Informed Neural Networks for Predicting Temperature Distribution and Crater Geometry of Single Discharge Spark in Electric Discharge Machining

    Article • October 2026, Springer Science + Business Media

    Mr Hoang-Tien Cao

  2. Microstructural and comparative analysis for wire electric discharge machining on edge trimming of semi-insulating silicon carbide wafers

    Article • Materials Today Communications, September 2026, Elsevier

    Mr Hoang-Tien Cao

  3. Artificial intelligence-based predictive modeling of surface roughness in external turning of C45 steel

    Article • Journal of the Chinese Institute of Engineers, February 2026, Taylor & Francis

    Mr Hoang-Tien Cao

  4. Characterization of machined surface in semi-conductive SiC wafer subjected to micro-EDM drilling

    Article • Materials Science in Semiconductor Processing, March 2025, Elsevier

    Mr Hoang-Tien Cao, Mr Hoang-Tien Cao

  5. Machined quality prediction and optimization for micro-EDM drilling of semi-conductive SiC wafer

    Article • Materials Science in Semiconductor Processing, January 2024, Elsevier

    Mr Hoang-Tien Cao, Mr Hoang-Tien Cao

  6. Soil Moisture Monitoring System Based on LoRa Network

    Article • January 2021, Springer Science + Business Media

    Mr Hoang-Tien Cao, Mr Hoang-Tien Cao

  7. IoT application that applied for agriculture

    Article • April 2017, Institute of Electrical & Electronics Engineers (IEEE)

    Mr Hoang-Tien Cao, Mr Hoang-Tien Cao