All Stories

  1. Room temperature magnetic anisotropy in Fe2P-type transition metal based alloys

    Article • Journal of Alloys and Compounds, September 2019, Elsevier

    Tegus Ojiyed

  2. Effect of Moisture Content on the Diverse Structure State of the Octanoyl Alanine Metal (Mg, Ca) Complexes

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Naren Gerile, Tegus Ojiyed

  3. Effect of Milling Time on Microstructures and Electrochemical Properties of AB3.5-Type La-Mg-Ni-Co-Al Hydrogen Storage Alloys

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Tegus Ojiyed, zhang xin

  4. Effects of a Large Content of Yttrium Doping on Microstructure and Magnetostriction of Fe83Ga17 Alloy

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Tegus Ojiyed

  5. Magnetism and Mechanical Properties of Mn1.28Fe0.67P0.48Si0.52 / Cu Composites

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Tegus Ojiyed

  6. Optimization of PEDOT:PSS Hole Transport Layer Toward the Organic Solar Cells with High Fill Factor

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Naren Gerile, Tegus Ojiyed, hong Lian

  7. Femtosecond Pump Probe Spectroscopy Implementation for Semiconductors

    Article • Solid State Phenomena, March 2019, Trans Tech Publications

    Tegus Ojiyed, Baatarchuluun Tsermaa, Jav Davaasambuu

  8. Preparation of Black Phosphorus by the Mechanical Ball Milling Method and its Characterization

    Article • Solid State Phenomena, January 2018, Trans Tech Publications

    Naren Gerile, Tegus Ojiyed

  9. Influence of the Active Layer Thickness on Non-Fullerene Polymer Solar Cell Performance

    Article • Solid State Phenomena, January 2018, Trans Tech Publications

    Tegus Ojiyed

  10. Magnetic Properties of Nd3Fe27.7-xNixTi1.3 Compounds

    Article • Solid State Phenomena, January 2018, Trans Tech Publications

    Tegus Ojiyed

  11. Novel magnetocaloric materials: not only for cooling applications

    Article • May 2006, Institute of Electrical & Electronics Engineers (IEEE)

    Tegus Ojiyed