All Stories

  1. Mechanical properties of FeCo magnetic particles-based Sn-Ag-Cu solder composites

    Article • Frontiers in Human Neuroscience, June 2013, American Institute of Physics

    Siyang Xu

  2. Modeling of localized reflow in solder/magnetic nanocomposites for area-array packaging

    Article • Journal of Applied Physics, March 2013, American Institute of Physics

    Siyang Xu

  3. Effects of FeCo magnetic nanoparticles on microstructure of Sn-Ag-Cu alloys

    Article • Journal of Applied Physics, February 2013, American Institute of Physics

    Siyang Xu

  4. The role of eddy currents and nanoparticle size on AC magnetic field–induced reflow in solder/magnetic nanocomposites

    Article • Journal of Applied Physics, February 2012, American Institute of Physics

    Siyang Xu