All Stories

  1. A multi-level cell for ultra-scaled STT-MRAM realized by back-hopping
  2. Micromagnetic modeling of double spin-torque magnetic tunnel junction devices
  3. Electron and spin transport in semiconductor and magnetoresistive devices
  4. Investigating Reliability Issues in Multi-Layered STT-MRAM with Synthetic Antiferromagnets
  5. Advancing Nonvolatile Memory Technologies: Enhancing Reliability and Performance through Double Spin Torque Magnetic Tunnel Junctions and Interlayer Exchange Coupling
  6. Field-Free Perpendicular Magnetization Switching of SOT-MRAM Devices by Magnetic Spin Hall Effect
  7. Influence of Interface Exchange Coupling in Multilayered Spintronic Structures
  8. Advanced Modeling and Simulation of Multilayer Spin–Transfer Torque Magnetoresistive Random Access Memory with Interface Exchange Coupling
  9. Micromagnetic modeling of SOT-MRAM dynamics
  10. Numerical study of two-terminal SOT-MRAM
  11. The XIV. European Magnetic Sensors and Actuators Conference - Book of Abstracts
  12. Magnetic and Spin Devices, Volume II
  13. Charge and Spin Transport in Semiconductor Devices
  14. A multi-level cell for ultra-scaled STT-MRAM realized by back-hopping
  15. Comprehensive Modeling of Advanced Composite Magnetoresistive Devices
  16. A Comprehensive Study of Temperature and Its Effects in SOT-MRAM Devices
  17. Statistical study of electromigration in gold interconnects
  18. A Theoretical Study of Armchair Antimonene Nanoribbons in the Presence of Uniaxial Strain Based on First-Principles Calculations
  19. Technology Computer‐Aided Design
  20. Multi-level Operation in Ultra-scaled MRAM
  21. Comprehensive mobility study of silicon nanowire transistors using multi-subband models
  22. Finite Element Approach for the Simulation of Modern MRAM Devices
  23. Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
  24. The influence of interface effects on the switching behavior in ultra-scaled MRAM cells
  25. Modeling thermal effects in STT-MRAM
  26. Microstructural impact on electromigration reliability of gold interconnects
  27. Comprehensive evaluation of torques in ultra-scaled MRAM devices
  28. Finite Element Method for MRAM Switching Simulations
  29. Spin and charge drift-diffusion in ultra-scaled MRAM cells
  30. Spin-Based Devices for Digital Applications
  31. Macroscopic Transport Models for Classical Device Simulation
  32. About electron transport and spin control in semiconductor devices
  33. Design Analysis of Ultra-Scaled MRAM Cells
  34. Application of Two-Dimensional Materials towards CMOS-Integrated Gas Sensors
  35. Challenges for Nanoscale CMOS Logic Based on Two-Dimensional Materials
  36. Impact of Gold Interconnect Microstructure on Electromigration Failure Time Statistics
  37. Spin Torques in ULTRA-Scaled MRAM Devices
  38. Spin and Charge Drift-Diffusion in Ultra-Scaled MRAM Cells
  39. Double Reference Layer STT-MRAM Structures with Improved Performance
  40. Finite element modeling of spin–orbit torques
  41. Interface effects in ultra-scaled MRAM cells
  42. Spin Transfer Torque Evaluation Based on Coupled Spin and Charge Transport: A Finite Element Method Approach
  43. Statistical Study of Electromigration in Gold Interconnects
  44. About the Switching Energy of a Magnetic Tunnel Junction determined by Spin-Orbit Torque and Voltage-Controlled Magnetic Anisotropy
  45. Temperature increase in STT-MRAM at writing: A fully three-dimensional finite element approach
  46. Spin Transfer Torque Evaluation Based on Coupled Spin and Charge Transport: A Finite Element Method Approach
  47. Electromigration Degradation of Gold Interconnects: A Statistical Study
  48. Spin Transfer Torques in Ultra-Scaled MRAM Cells
  49. Magnetic and Spin Devices
  50. A review of quantum transport in field-effect transistors
  51. Advances in modeling emerging magnetoresistive random access memories: from finite element methods to machine learning approaches
  52. Modeling advanced spintronic based magnetoresistive memory
  53. Geometric advection and its application in the emulation of high aspect ratio structures
  54. Coupled spin and charge drift-diffusion approach applied to magnetic tunnel junctions
  55. Two-pulse switching scheme and reinforcement learning for energy efficient SOT-MRAM simulations
  56. Improving failure rates in pulsed SOT-MRAM switching by reinforcement learning
  57. Subbands in a nanoribbon of topologically insulating MoS2 in the 1T′ phase
  58. Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node
  59. Finite Element Method Approach to MRAM Modeling
  60. Reinforcement Learning Approach for Sub-Critical Current SOT-MRAM Switching
  61. Spin and Charge Drift-Diffusion Approach to Torque Computation in Magnetic Tunnel Junctions
  62. Reinforcement Learning to Reduce Failures in SOT-MRAM Switching
  63. Gas Sensing with Two-Dimensional Materials Beyond Graphene
  64. Temperature Increase in MRAM at Writing: A Finite Element Approach
  65. Reinforcement learning approach for deterministic SOT-MRAM switching
  66. Electromagnetic Coherent Electron Control
  67. Optimization of a Spin-Orbit Torque Switching Scheme Based on Micromagnetic Simulations and Reinforcement Learning
  68. Review—Modeling Methods for Analysis of Electromigration Degradation in Nano-Interconnects
  69. Nanowire Field-Effect Transistor (FET)
  70. A computational approach for investigating Coulomb interaction using Wigner–Poisson coupling
  71. Concepts of Device Modeling
  72. Emerging CMOS Compatible Magnetic Memories and Logic
  73. Event Biasing
  74. Evolution in a Quantum Wire
  75. General Transport: Self-Consistent Mixed Problem
  76. Hierarchy of Kinetic Models
  77. Homogeneous Transport: Empirical Approach
  78. Homogeneous Transport: Stochastic Approach
  79. Inhomogeneous Stationary Transport
  80. Microstructure and Granularity Effects in Electromigration
  81. Monte Carlo Computing
  82. Numerical Analysis of Deterministic Switching of a Perpendicularly Magnetized Spin-Orbit Torque Memory Cell
  83. Self-consistent Monte Carlo Solution of Wigner and Poisson Equations Using an Efficient Multigrid Approach
  84. Small Signal Analysis
  85. Stationary Quantum Particle Attributes
  86. Stochastic Approaches to Electron Transport in Micro- and Nanostructures
  87. The Semiconductor Model: Fundamentals
  88. Transient Quantum Particle Attributes
  89. Transport Theories in Phase Space
  90. Wigner Function Modeling
  91. Ballistic Conductance in a Topological 1T '-MoS2 Nanoribbon
  92. Conductance in a Nanoribbon of Topologically Insulating MoS2 in the 1T’ Phase
  93. Complex Systems in Phase Space
  94. Computation of Torques in Magnetic Tunnel Junctions through Spin and Charge Transport Modeling
  95. Efficient Demagnetizing Field Calculation for Disconnected Complex Geometries in STT-MRAM Cells
  96. Geometric Advection Algorithm for Process Emulation
  97. Comprehensive Modeling of Coupled Spin and Charge Transport through Magnetic Tunnel Junctions
  98. Reduced Current Spin-Orbit Torque Switching of a Perpendicularly Magnetized Free Layer
  99. Topologically Protected and Conventional Subbands in a 1T’ -MoS2 Nanoribbon Channel
  100. Comprehensive modeling of coupled spin-charge transport and magnetization dynamics in STT-MRAM cells
  101. Parallel Correction for Hierarchical Re-Distancing Using the Fast Marching Method
  102. Subband Structure and Ballistic Conductance of a Molybdenum Disulfide Nanoribbon in Topological 1T’ Phase: A k·p Study
  103. Robust magnetic field-free switching of a perpendicularly magnetized free layer for SOT-MRAM
  104. Influence of Current Redistribution in Switching Models for Perpendicular STT-MRAM
  105. Influence of Current Redistribution in Switching Models for Perpendicular STT-MRAM
  106. Integration of Gas Sensors with CMOS Technology
  107. Perpendicular STT-MRAM Switching at Fixed Voltage and at Fixed Current
  108. Emerging CMOS Compatible Magnetic Memories and Logic
  109. Granularity Effects in Electromigration
  110. A Monte Carlo Evaluation of the Current and Low Frequency Current Noise at Spin-Dependent Hopping
  111. Analysis of Switching Under Fixed Voltage and Fixed Current in Perpendicular STT-MRAM
  112. Parallelized Construction of Extension Velocities for the Level-Set Method
  113. The Level-Set Method for Multi-Material Wet Etching and Non-Planar Selective Epitaxy
  114. CMOS Technology Compatible Magnetic Memories
  115. Mobility of Circular and Elliptical Si Nanowire Transistors Using a Multi-Subband 1D Formalism
  116. Magnetic field-free deterministic switching of a perpendicular magnetic layer by spin-orbit torques
  117. CMOS-Compatible Gas Sensors
  118. Novel Numerical Dissipation Scheme for Level-Set Based Anisotropic Etching Simulations
  119. Parallelized Level-Set Velocity Extension Algorithm for Nanopatterning Applications
  120. Process Simulation in the Browser: Porting ViennaTS using WebAssembly
  121. Switching Speedup of the Magnetic Free Layer of Advanced SOT-MRAM
  122. Current and shot noise at spin-dependent hopping through junctions with ferromagnetic contacts
  123. Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors
  124. Surface Morphology of 4H-SiC after Thermal Oxidation
  125. A Flexible Shared-Memory Parallel Mesh Adaptation Framework
  126. Simulation of the Effects of Postimplantation Annealing on Silicon Carbide DMOSFET Characteristics
  127. Spin-Based CMOS-Compatible Memories
  128. Miniaturized Transistors
  129. Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates
  130. Two-pulse sub-ns switching scheme for advanced spin-orbit torque MRAM
  131. A shared memory parallel multi-mesh fast marching method for re-distancing
  132. Efficient Magnetic Field-Free Switching of a Symmetric Perpendicular Magnetic Free Layer for Advanced SOT-MRAM
  133. Combining Perpendicular and Shape Anisotropy for Optimal Switching of Advanced Spin-Orbit Torque Memory Cells
  134. Energy Efficient Computing & Electronics
  135. Wigner equation for general electromagnetic fields: The Weyl-Stratonovich transform
  136. Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices
  137. Simulation of the Impact of Ionized Impurity Scattering on the Total Mobility in Si Nanowire Transistors
  138. A Wigner Potential Decomposition in the Signed-Particle Monte Carlo Approach
  139. Evaluation of Serial and Parallel Shared-Memory Distance-1 Graph Coloring Algorithms
  140. Enhanced Sensing Performance of Integrated Gas Sensor Devices
  141. Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review
  142. Accelerating Flux Calculations Using Sparse Sampling
  143. Nanowire FETs
  144. Spin correlations at hopping in magnetic structures: from tunneling magnetoresistance to single-spin transistor
  145. Field-free Fast Reliable Deterministic Switching in Perpendicular Spin-Orbit Torque MRAM Cells
  146. Impact of the Effective Mass on the Mobility in Si Nanowire Transistors
  147. Steady-State Empirical Model for Electrical Activation of Silicon-Implanted Gallium Nitride
  148. Stochastic analysis of surface roughness models in quantum wires
  149. Transient model for electrical activation of aluminium and phosphorus-implanted silicon carbide
  150. Modeling and Simulation of Electrical Activation of Acceptor-Type Dopants in Silicon Carbide
  151. Ultra-Fast Switching of a Free Magnetic Layer with Out-of-Plane Magnetization in Spin-Orbit Torque MRAM Cells
  152. Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices
  153. Current and shot noise at spin-dependent hopping through magnetic tunnel junctions
  154. Study of the 1D Scattering Mechanisms' Impact on the Mobility in Si Nanowire Transistors
  155. Switching current reduction in advanced spin-orbit torque MRAM
  156. Unified feature scale model for etching in SF6 and Cl plasma chemistries
  157. Empirical Model for Electrical Activation of Aluminum- and Boron-Implanted Silicon Carbide
  158. Demands for spin-based nonvolatility in emerging digital logic and memory devices for low power computing
  159. Sparse Surface Speed Evaluation on a Dynamic Three-Dimensional Surface Using an Iterative Partitioning Scheme
  160. Simulation of Injection Currents into Disordered Molecular Conductors
  161. Micro- and Nanoelectronics
  162. ReaxFF Reactive Molecular Dynamics Study of Orientation Dependence of Initial Silicon Carbide Oxidation
  163. Non-volatility by spin in modern nanoelectronics
  164. Accelerated direct flux calculations using an adaptively refined icosahedron
  165. Modeling electromigration in nanoscaled copper interconnects
  166. Modeling of electrical activation ratios of phosphorus and nitrogen doped silicon carbide
  167. Analysis of lense-governed Wigner signed particle quantum dynamics (Phys. Status Solidi RRL 7/2017)
  168. Evaluation of the shared-memory parallel Fast Marching Method for re-distancing problems
  169. Analysis of lense-governed Wigner signed particle quantum dynamics
  170. Anisotropic interpolation method of silicon carbide oxidation growth rates for three-dimensional simulation
  171. Framework to model neutral particle flux in convex high aspect ratio structures using one-dimensional radiosity
  172. Special Issue of Solid-State Electronics, dedicated to EUROSOI-ULIS 2016
  173. Using Temporary Explicit Meshes for Direct Flux Calculation on Implicit Surfaces
  174. Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology
  175. Stress Evolution During Nanoindentation in Open TSVs
  176. CMOS-compatible spintronic devices: a review
  177. Growth rates of dry thermal oxidation of 4H-silicon carbide
  178. Layer coupling and read disturbances in a buffered magnetic logic environment
  179. A Universal Nonvolatile Processing Environment
  180. Magnetic field dependent tunneling magnetoresistance through a quantum well between ferromagnetic contacts
  181. The exploitation of magnetization orientation encoded spin-transfer torque for an ultra dense non-volatile magnetic shift register
  182. Three-dimensional growth rate modeling and simulation of silicon carbide thermal oxidation
  183. Using one-dimensional radiosity to model neutral flux in convex high aspect ratio structures
  184. INSTITUT FÜR MIKROELEKTRONIK / INSTITUTE FOR MICROELECTRONICS
  185. Stress in three-dimensionally integrated sensor systems
  186. Effects of the Deposition Process Variation on the Performance of Open TSVs
  187. Impact of across-wafer variation on the electrical performance of TSVs
  188. Device physics, modeling, and technology for nano-scaled semiconductor devices
  189. Silicon-on-Insulator for Spintronic Applications: Spin Lifetime and Electric Spin Manipulation
  190. Enhancement of Electron Spin Relaxation Time in Thin SOI Films by Spin Injection Orientation and Uniaxial Stress
  191. Direction dependent three-dimensional silicon carbide oxidation growth rate calculations
  192. Influence of spin relaxation on trap-assisted resonant tunneling in ferromagnet-oxide-semiconductor structures
  193. Preface
  194. Using one-dimensional radiosity to model neutral particle flux in high aspect ratio holes
  195. ViennaCL---Linear Algebra Library for Multi- and Many-Core Architectures
  196. Electron Momentum and Spin Relaxation in Silicon Films
  197. Evaluation of Mobile ARM-Based SoCs for High Performance Computing
  198. Neumann Series Analysis of the Wigner Equation Solution
  199. Processing of integrated gas sensor devices
  200. Intersubband spin relaxation reduction and spin lifetime enhancement by strain in SOI structures
  201. SOT-MRAM based on 1Transistor-1MTJ-cell structure
  202. Electron mobility and spin lifetime enhancement in strained ultra-thin silicon films
  203. Injection direction sensitive spin lifetime model in a strained thin silicon film
  204. Global statistical methodology for the analysis of equipment parameter effects on TSV formation
  205. Improved drive-current into nanoscaled channels using electrostatic lenses
  206. Improving the performance of a non-volatile magnetic flip flop by exploiting the spin Hall effect
  207. Influence of valley splitting on spin relaxation time in a strained thin silicon film
  208. Memory-efficient particle annihilation algorithm for Wigner Monte Carlo simulations
  209. ViennaMaterials – A dedicated material library for computational science and engineering
  210. Transformation invariant local element size specification
  211. CMOS-compatible spintronic devices
  212. Intrinsic stress analysis of tungsten-lined open TSVs
  213. The Wigner equation in the presence of electromagnetic potentials
  214. Boundary conditions and the Wigner equation solution
  215. Silicon spintronics: Progress and challenges
  216. Influence of magnetization variations in the free layer on a non-volatile magnetic flip flop
  217. Compact model for solder bump electromigration failure
  218. Spin-based devices for future microelectronics
  219. Coupled simulation to determine the impact of across wafer variations in oxide PECVD on electrical and reliability parameters of through-silicon vias
  220. Novel Buffered Magnetic Logic Gate Grid
  221. Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors
  222. Variation of Spin Lifetime with Spin Injection Orientation in Strained Thin Silicon Films
  223. (Invited) Spin-Based Silicon and CMOS-Compatible Devices
  224. Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors
  225. Modelling of multipurpose spintronic devices
  226. Dependence of spin lifetime on spin injection orientation in strained silicon films
  227. A comparison of approaches for the solution of the Wigner equation
  228. Evaluation of Spin Lifetime in Thin-Body FETs: A High Performance Computing Approach
  229. Free Open Source Mesh Healing for TCAD Device Simulations
  230. Optimized Particle Regeneration Scheme for the Wigner Monte Carlo Method
  231. Parallelization of the Two-Dimensional Wigner Monte Carlo Method
  232. Spin-Based CMOS-Compatible Devices
  233. The Influence of Electrostatic Lenses on Wave Packet Dynamics
  234. Progress in Magnetoresistive Memory: Magnetic Tunnel Junctions with a Composite Free Layer
  235. Spin injection in a semiconductor through a space-charge layer
  236. Highly flexible and reusable finite element simulations with ViennaX
  237. The meshing framework ViennaMesh for finite element applications
  238. Distributed-memory parallelization of the Wigner Monte Carlo method using spatial domain decomposition
  239. Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes
  240. On the material depletion rate due to electromigration in a copper TSV structure
  241. Electromigration in solder bumps: A mean-time-to-failure TCAD study
  242. Electromigration induced resistance increase in open TSVs
  243. Increasing mobility and spin lifetime with shear strain in thin silicon films
  244. Influence of device geometry on the non-volatile magnetic flip flop characteristics
  245. Manufacturing of 3D integrated sensors and circuits
  246. Progress in Magnetoresistive Memory: Magnetic Tunnel Junctions with a Composite Free Layer
  247. Template-based mesh generation for semiconductor devices
  248. The Wigner Monte Carlo method for accurate semiconductor device simulation
  249. Three-dimensional simulation for the reliability and electrical performance of through-silicon vias
  250. Electromigration reliability of open TSV structures
  251. The effects of etching and deposition on the performance and stress evolution of open through silicon vias
  252. Investigation of Novel Silicon PV Cells of a Lateral Type
  253. Spin diffusion and the role of screening effects in semiconductors
  254. Compact modeling of memristive IMP gates for reliable stateful logic design
  255. Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs
  256. Efficient calculation of the two-dimensional Wigner potential
  257. Frequency dependence study of a bias field-free nano-scale oscillator
  258. Implications of the coherence length on the discrete Wigner potential
  259. Magnetic tunnel junctions for future memory and logic-in-memory applications
  260. Spin lifetime in strained silicon films
  261. Valley splitting and spin lifetime enhancement in strained thin silicon films
  262. Effects of sidewall scallops on open tungsten TSVs
  263. Electromigration reliability of open TSV structures
  264. Electromigration reliability of solder bumps
  265. Novel bias-field-free spin transfer oscillator
  266. Modeling spin-based electronic devices
  267. Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications
  268. Electromigration induced failure of solder bumps and the role of IMC
  269. High performance MRAM-based stateful logic
  270. Influence of magnetization variations in the free layer on a non-volatile magnetic flip flop
  271. Modeling of spin-based silicon technology
  272. Process and reliability of SF6/O2 plasma etched copper TSVs
  273. Methods of simulating thin film deposition using spray pyrolysis techniques
  274. Composite magnetic tunnel junctions for fast memory devices and efficient spin-torque nano-oscillators
  275. Electron dynamics in nanoscale transistors by means of Wigner and Boltzmann approaches
  276. Spin injection and diffusion in silicon based devices from a space charge layer
  277. A benchmark study of the Wigner Monte Carlo method
  278. Implementation and analysis of an adaptive multilevel Monte Carlo algorithm
  279. Microstructural impact on electromigration: A TCAD study
  280. Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors
  281. Modeling of microstructural effects on electromigration failure
  282. Stochastic Formulation of Newton’s Acceleration
  283. The Non-Equilibrium Green's Function Method for Nanoscale Device Simulation
  284. The Role of Annihilation in a Wigner Monte Carlo Approach
  285. Uniaxial Shear Strain as a Mechanism to Increase Spin Lifetime in Thin Film of a SOI-Based Silicon Spin FETs
  286. Reliability Analysis and Comparison of Implication and Reprogrammable Logic Gates in Magnetic Tunnel Junction Logic Circuits
  287. Subband splitting and surface roughness induced spin relaxation in (001) silicon SOI MOSFETs
  288. Simulation study of an electrically read- and writable magnetic logic gate
  289. Decoherence and time reversibility: The role of randomness at interfaces
  290. Acoustic Phonon and Surface Roughness Spin Relaxation Mechanisms in Strained Ultra-Scaled Silicon Films
  291. Reliability-Based Optimization of Spin-Transfer Torque Magnetic Tunnel Junction Implication Logic Gates
  292. Electromigration induced stress in open TSVs
  293. Electromigration enhanced growth of intermetallic compound in solder bumps
  294. Structural optimization of MTJs with a composite free layer
  295. Electromigration analyses of open TSVs
  296. Evaluation of spin lifetime in strained UT2B silicon-on-insulator MOSFETs
  297. Impact of intermetallic compound on solder bump electromigration reliability
  298. Influence of temperature on the standard deviation of electromigration lifetimes
  299. Modeling the growth of thin SnO2 films using spray pyrolysis deposition
  300. Performance analysis and comparison of two 1T/1MTJ-based logic gates
  301. Quantum insights in gate oxide charge-trapping dynamics in nanoscale MOSFETs
  302. Reduction of momentum and spin relaxation rate in strained thin silicon films
  303. Rigorous simulation study of a novel non-volatile magnetic flip-flop
  304. Stress estimation in open tungsten TSV
  305. Two-dimensional transient wigner particle model
  306. Stress evolution in the metal layers of TSVs with Bosch scallops
  307. MRAM-based logic array for large-scale non-volatile logic-in-memory applications
  308. Novel MTJ-based shift register for non-volatile logic applications
  309. A method for simulating Atomic Force Microscope nanolithography in the Level Set framework
  310. Analysis of solder bump electromigration reliability
  311. Transverse domain wall formation in a free layer: A mechanism for switching failure in a MTJ-based STT-MRAM
  312. Using strain to increase the reliability of scaled spin MOSFETs
  313. Magnetic Tunnel Junctions with a Composite Free Layer: A New Concept for Future Universal Memory
  314. Decoherence effects in the Wigner function formalism
  315. Design and applications of magnetic tunnel junction based logic circuits
  316. Implication logic gates using spin-transfer-torque-operated magnetic tunnel junctions for intrinsic logic-in-memory
  317. Physically based models of electromigration
  318. Spin Lifetime Enhancement by Shear Strain in Thin Silicon-On-Insulator Films
  319. Wigner quasi-particle attributes—An asymptotic perspective
  320. Influence of the valley degeneracy on spin relaxation in thin silicon films
  321. ViennaX: a parallel plugin execution framework for scientific computing
  322. Physical scales in the Wigner–Boltzmann equation
  323. A Flexible Dynamic Data Structure for Scientific Computing
  324. A Lightweight Task Graph Scheduler for Distributed High-Performance Scientific Computing
  325. Distributed High-Performance Parallel Mesh Generation with ViennaMesh
  326. Multiple purpose spin transfer torque operated devices
  327. Strain-induced reduction of surface roughness dominated spin relaxation in MOSFETs
  328. We make electrons dance
  329. Influence of Geometry on the Memristive Behavior of the Domain Wall Spintronic Memristors and Its Applications for Measurement
  330. Thermo-mechanical simulations of an open tungsten TSV
  331. Chapter 11. A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator
  332. Chapter 22. Monte Carlo Investigations of Electron Decoherence due to Phonons
  333. Electrothermal analysis of In0.12Al0.88N/GaN HEMTs
  334. Formation and movement of voids in copper interconnect structures
  335. MTJ-based implication logic gates and circuit architecture for large-scale spintronic stateful logic systems
  336. Electromigration failure in a copper dual-damascene structure with a through silicon via
  337. Analysis of Resistance Change Development Due to Voiding in Copper Interconnects Ended by A Through Silicon Via
  338. Electric Field Based Simulations of Local Oxidation Nanolithography Using Atomic Force Microscopy in a Level Set Environment
  339. Interconnect reliability dependence on fast diffusivity paths
  340. Ab initio method for electromigration analysis
  341. Atomistic method for analysis of electromigration
  342. Recent developments in advanced memory modeling
  343. Temperature dependence of the transport properties of spin field-effect transistors built with InAs and Si channels
  344. MTJs with a composite free layer for high-speed spin transfer torque RAM: Micromagnetic simulations
  345. Particle-grid techniques for semiclassical and quantum transport simulations
  346. Reduction of surface roughness induced spin relaxation in SOI MOSFETs
  347. Role of the physical scales on the transport regime
  348. Towards a free open source process and device simulation framework
  349. Fast Switching in Magnetic Tunnel Junctions With Two Pinned Layers: Micromagnetic Modeling
  350. Emerging memory technologies: Trends, challenges, and modeling methods
  351. New trends in microelectronics: Towards an ultimate memory concept
  352. New trends in microelectronics: Towards an ultimate memory concept
  353. Physics-Based Modeling of GaN HEMTs
  354. A Numerical Study of Line-Edge Roughness Scattering in Graphene Nanoribbons
  355. A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy
  356. Efficient Simulations of the Transport Properties of Spin Field-Effect Transistors Built on Silicon Fins
  357. GPU-Accelerated Non-negative Matrix Factorization for Text Mining
  358. Phonon-Induced Decoherence in Electron Evolution
  359. Towards Distributed Heterogenous High-Performance Computing with ViennaCL
  360. Modeling Emerging Non-volatile Memories: Current Trends and Challenges
  361. Domain-wall spintronic memristor for capacitance and inductance sensing
  362. Properties of InAs- and silicon-based ballistic spin field-effect transistors operated at elevated temperature
  363. Switching time and current reduction using a composite free layer in magnetic tunnel junctions
  364. An Analytical Model for Line-Edge Roughness Limited Mobility of Graphene Nanoribbons
  365. Modeling of advanced memories
  366. Strained MOSFETs on ordered SiGe dots
  367. Compact modeling of interconnect reliability
  368. Ballistic Transport Properties of Spin Field-Effect Transistors Built on Silicon and InAs Fins
  369. Modeling Electromigration Lifetimes of Copper Interconnects
  370. Reduction of switching time in pentalayer magnetic tunnel junctions with a composite-free layer
  371. A Level Set simulator for nanooxidation using non-contact atomic force microscopy
  372. A compact model for early electromigration lifetime estimation
  373. High-quality mesh generation based on orthogonal software modules
  374. Multilevel simulation for the investigation of fast diffusivity paths
  375. Properties of InAs- and silicon-based ballistic spin field-effect transistors
  376. A compact model for early electromigration failures of copper dual-damascene interconnects
  377. Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Methodology
  378. Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Results
  379. Performance Assessment of Nanoscale Field-Effect Diodes
  380. Foreword Special Issue on Characterization of Nano CMOS Variability by Simulation and Measurements
  381. Perspectives of Silicon for Future Spintronic Applications From the Peculiarities of the Subband Structure in Thin Films
  382. Integration of atomistic and continuum-level electromigration models
  383. A simulator for local anodic oxidation of silicon surfaces
  384. Properties of Silicon Ballistic Spin Fin-Based Field-Effect Transistors
  385. Subband Structure Engineering in Silicon-On-Insulator FinFETs Using Confinement
  386. Transport properties of spin field-effect transistors built on Si and InAs
  387. Electromigration in submicron interconnect features of integrated circuits
  388. The Economic Limit to Moore's Law
  389. Stochastic model of the resistive switching mechanism in bipolar resistive random access memory: Monte Carlo simulations
  390. Classical Device Modeling
  391. Deterministic Solvers for the Boltzmann Transport Equation
  392. Modeling of the SET and RESET Process in Bipolar Resistive Oxide-Based Memory Using Monte Carlo Simulations
  393. Parallelization Strategy for Hierarchical Run Length Encoded Data Structures
  394. Stochastic Algorithm for Solving the Wigner-Boltzmann Correction Equation
  395. Strain-Induced Effects in Advanced MOSFETs
  396. Transport modeling for nanoscale semiconductor devices
  397. Stochastic modeling of bipolar resistive switching in metal-oxide based memory by Monte Carlo technique
  398. A Monte Carlo simulation of reproducible hysteresis in RRAM
  399. A stochastic model of bipolar resistive switching in metal-oxide-based memory
  400. Impact of parameter variability on electromigration lifetime distribution
  401. Stochastic modeling hysteresis and resistive switching in bipolar oxide-based memory
  402. Strained MOSFETs on ordered SiGe dots
  403. Three-dimensional simulation of focused ion beam processing using the level set method
  404. Silicon for Spintronic Applications: Strain-Enhanced Valley Splitting
  405. Electromigration anisotropy and mechanical stress in modern copper interconnect
  406. Stochastic modeling of the resistive switching mechanism in oxide-based memory
  407. Modeling demands for nanoscale devices
  408. Physically based models of electromigration: From Black’s equation to modern TCAD models
  409. The Economic Limit to Moore's Law [Point of View
  410. Electron subband structure in strained silicon UTB films from the Hensel–Hasegawa–Nakayama model – Part 1 analytical consideration and strain-induced valley splitting
  411. Analysis of Thermoelectric Properties of Scaled Silicon Nanowires Using an Atomistic Tight-Binding Model
  412. A Dispatched Covariant Type System for Numerical Applications in C++
  413. A Modular Tool Chain for High Performance CFD Simulations in Intracranial Aneurysms
  414. A Unified Topological Layer for Finite Element Space Discretization
  415. Abgeleitete Datentypen
  416. Ausdrücke
  417. Biotin-Streptavidin Sensitive BioFETs and Their Properties
  418. Dateien
  419. Datenstrukturen
  420. Die Entwicklungsumgebung
  421. Dynamischer Speicher
  422. Ein exemplarisches Software-Projekt
  423. Einführung
  424. Eingabe — Ausgabe
  425. Erste Schritte
  426. Fehlerbehandlung
  427. Felder
  428. Funktionen
  429. Grafische Darstellungsmittel
  430. Iterationen
  431. Modeling floating body Z-RAM storage cells
  432. Numerik
  433. Numerische Datentypen
  434. Particle Model of the Scattering-Induced Wigner Function Correction
  435. Programmieren in C
  436. Rekursive Funktionen
  437. Relation between the PCB near field and the common mode coupling from the PCB to cables
  438. Selektionen
  439. Simulation of Field-Effect Biosensors (BioFETs) for Biotin-Streptavidin Complexes
  440. Speicherklassen
  441. Three-dimensional level set based Bosch process simulations using ray tracing for flux calculation
  442. Transport in Nanostructures: A Comparative Analysis Using Monte Carlo Simulation, the Spherical Harmonic Method, and Higher Moments Models
  443. Variablen, Konstanten
  444. Zeichenketten
  445. Zeiger
  446. GUIDE: Parallel library-centric application design by a generic scientific simulation environment
  447. Synergies in scientific computing by combining multi-paradigmatic languages for high-performance applications
  448. Subband parameters in strained (110) silicon films from the Hensel-Hasegawa-Nakayama model of the conduction band
  449. Analysis of Electromigration in Dual-Damascene Interconnect Structures
  450. Mobility Modeling in Advanced MOSFETs with Ultra-Thin Silicon Body under Stress
  451. Electromigration failure development in modern dual-damascene interconnects
  452. Scaling of advanced floating body Z-RAM storage cells: A modeling approach
  453. Modeling of modern MOSFETs with strain
  454. Guest editorial
  455. Modeling Techniques for Strained CMOS Technology
  456. Impact of Confinement and Stress on the Subband Parameters in Ultra-Thin Silicon Films
  457. The Effect of Microstructure on Electromigration-Induced Failure Development
  458. Three-Dimensional Plasma Etching Simulation using Advanced Ray Tracing and Level Set Techniques
  459. Dependence of Injection Velocity and Capacitance of Si Nanowires on Diameter, Orientation, and Gate Bias: An Atomistic Tight-Binding Study
  460. A Fast Void Detection Algorithm for Three-Dimensional Deposition Simulation
  461. Copper Microstructure Impact on Evolution of Electromigration Induced Voids
  462. Performance evaluation of graphene nanoribbon infrared photodetectors
  463. The Effect of Copper Grain Size Statistics on the Electromigration Lifetime Distribution
  464. Thickness Dependence of the Effective Masses in a Strained Thin Silicon Film
  465. A fast level set framework for large three-dimensional topography simulations
  466. The effect of microstructure on electromigration induced voids
  467. The effect of microstructure on the electromigration lifetime distribution
  468. Preface to the Special Section on Electromigration Published in March 2009
  469. Impact of Confinement of Semiconductor and Band Engineering on Future Device Performance
  470. Classical Approximation of the Scattering Induced Wigner Correction Equation
  471. Modeling of Low Concentrated Buffer DNA Detection with Suspend Gate Field-Effect Transistors (SGFET)
  472. The Linear Combination of Bulk Bands-Method for Electron and Hole Subband Calculations in Strained Silicon Films and Surface Layers
  473. A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects
  474. Valley splitting in thin silicon films from a two-band k·p model
  475. Cavity Model for the Slot Radiation of an Enclosure Excited by Printed Circuit Board Traces With Different Loads
  476. Stress-Induced Anisotropy of Electromigration in Copper Interconnects
  477. Modeling current transport in carbon nanotube transistors
  478. Electron subband structure and controlled valley splitting in silicon thin-body SOI FETs: Two-band k·p theory and beyond
  479. Numerical study of quantum transport in carbon nanotube transistors
  480. The effect of uniaxial stress on band structure and electron mobility of silicon
  481. Current transport in carbon nanotube transistors
  482. Two-band k·p model for the conduction band in silicon: Impact of strain and confinement on band structure and mobility
  483. Ultra-scaled Z-RAM cell
  484. A robust parallel delaunay mesh generation approach suitable for three-dimensional TCAD
  485. Analysis of electromigration in redundant vias
  486. Analysis of microstructure impact on electromigration
  487. Coupling of non-equilibrium Green’s function and Wigner function approaches
  488. Mobility enhancement in thin silicon films: Strain and thickness dependences of the effective masses and non-parabolicity parameter
  489. Radiated emission from the slot of a slim cubical enclosure with multiple sources inside
  490. Simulation of field-effect Biosensors (BioFETs)
  491. Three-dimensional topography simulation using advanced level set and ray tracing methods
  492. Mobility Modeling in Advanced MOSFETs with Ultra-Thin Silicon Body under Stress
  493. Domain separation with port interfaces for calculation of emissions from enclosure slots
  494. TCAD solutions for submicron copper interconnect
  495. Calculation of the radiation from the slot of a slim enclosure with a cavity resonator model
  496. Comprehensive modeling of electromigration induced interconnect degradation mechanisms
  497. Current transport in carbon nanotube transistors
  498. Comparative analysis of pseudo-potential and tight-binding band structure calculations with an analytical two-band k•p model: conduction band of silicon
  499. Stress-induced valley splitting in silicon thin films
  500. The effect of inelastic phonon scattering on carbon nanotube-based transistor performance
  501. Effect of strains on anisotropic material transport in copper interconnect structures under electromigration stress
  502. Electron subband dispersions in ultra-thin silicon films from a two-band k⋅p theory
  503. Analysis of Electromigration in Dual-Damascene Interconnect Structures
  504. Concepts for High-Perfomance Scientific Computing
  505. Current transport models for nanoscale semiconductor devices
  506. Reduction of the dark-current in carbon nanotube photo-detectors
  507. Three-dimensional simulation of sacrificial etching
  508. Strain-induced anisotropy of electromigration in copper interconnect
  509. Two-Band k·p model for the conduction band in silicon: impact of Strain and confinement on band structure and mobility
  510. Geometry optimization for carbon nanotube transistors
  511. Predictive Simulation of AlGaN/GaN HEMTs
  512. Electromigration Modeling for Interconnect Structures in Microelectronics
  513. Foreword Special Issue on Simulation and Modeling of Nanoelectronics Devices
  514. The Effect of General Strain on the Band Structure and Electron Mobility of Silicon
  515. High performance, uniaxially-strained, silicon and germanium, double-gate p-MOSFETs
  516. Numerical Simulation Of Biochemical Behaviour Of Biosensors With Perforated Membrane
  517. A study of ion implantation into crystalline germanium
  518. Alternating-Direction Implicit Formulation of the Finite-Element Time-Domain Method
  519. Editorial
  520. Three-dimensional simulation of sacrificial etching
  521. Comparison of deposition models for a TEOS LPCVD process
  522. Planarization of Silicon Dioxide and Silicon Nitride Passivation Layers
  523. VSP – A gate stack analyzer
  524. Scattering and space-charge effects in Wigner Monte Carlo simulations of single and double barrier devices
  525. Volume inversion mobility in SOI MOSFETs for different thin body orientations
  526. A multi-purpose Schrödinger-Poisson Solver for TCAD applications
  527. Dissipative transport in CNTFETs
  528. Editorial
  529. Tunneling CNTFETs
  530. Modeling of Advanced Semiconductor Devices
  531. Effects of shear strain on the conduction band in silicon: An efficient two-band k·p theory
  532. Electron Mobility Model for $\langle \hbox{110} \rangle$ Stressed Silicon Including Strain-Dependent Mass
  533. The role of inelastic electron-phonon interaction on the on-current and gate delay time of CNT FETs
  534. Investigation of Intrinsic Stress Effects in Cantilever Structures
  535. Optimization of the Perfectly Matched Layer for the Finite-Element Time-Domain Method
  536. A Computational Framework for Topological Operations
  537. Carbon Nanotube Based Transistors: A Computational Study
  538. Finite difference solutions of the nonlinear Schrödinger equation and their conservation of physical quantities
  539. Low-Field Mobility in Strained Silicon Inversion Layers and UTB MOSFETs for Different Substrate Orientations
  540. Modeling current transport in ultra-scaled field-effect transistors
  541. Self-Consistent Wigner Monte Carlo Simulations of Current in Emerging Nanodevices: Role of Tunneling and Scattering
  542. Simulation of Semiconductor Processes and Devices 2007
  543. Three-dimensional on-chip inductance and resistance extraction
  544. Physical modeling of electron mobility enhancement for arbitrarily strained silicon
  545. Scattering and space-charge effects in Wigner Monte Carlo simulations of single and double barrier devices
  546. High-Field Electron Mobility Model for Strained-Silicon Devices
  547. A Comprehensive Study of Carbon Nanotube Based Transistors: The Effects of Geometrical, Interface Barrier, and Scattering Parameters
  548. Numerical Analysis of Gate Stacks
  549. A Study of Boron Implantation into High Ge Content SiGe Alloys
  550. Anisotropic Mesh Refinement for the Simulation of Three-Dimensional Semiconductor Manufacturing Processes
  551. Generation of Unstructured Meshes for Process and Device Simulation by Means of Partial Differential Equations
  552. Orientation Dependence of the Low Field Mobility in Double-and Single-gate SOI FETs
  553. A Finite Element Time-Domain Algorithm Based on the Alternating-Direction Implicit Method
  554. Analytical Modeling of Electron Mobility in Strained Germanium
  555. Electron Inversion Layer Mobility Enhancement by Uniaxial Stress on (001) and (110) Oriented MOSFETs
  556. Monte Carlo Simulation of Boron Implantation into (100) Germanium
  557. Strain Effects on Quasi-Bound State Tunneling in Advanced SOI CMOS Technologies
  558. The Effect of Electron-Phonon Interaction on the Static and Dynamic Response of CNTFETs
  559. Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films
  560. Optimal Design for Carbon Nanotube Transistors
  561. Planarization of Passivation Layers during Manufacturing Processes of Image Sensors
  562. Efficient Calculation of Lifetime Based Direct Tunneling Through Stacked Dielectrics
  563. Impact of Random Bit Values on NBTI Lifetime of an SRAM Cell
  564. Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines
  565. Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress
  566. A fast and stable Poisson-Schrödinger solver for the analysis of carbon nanotube transistors
  567. Rigorous modeling of carbon nanotube transistors
  568. Current Flow in Upcoming Microelectronic Devices
  569. Device Simulation Demands of Upcoming Microelectronics Devices
  570. Low-Field Electron Mobility in Stressed UTB SOI MOSFETs for Different Substrate Orientations
  571. Analysis of Hole Transport in Arbitrarily Strained Germanium
  572. Theoretical Investigation Of Performance In Uniaxially- and Biaxially-Strained Si, SiGe and Ge Double-Gate p-MOSFETs
  573. Strain engineering for CMOS devices
  574. A Tensorial High-Field Electron Mobility Model for Strained Silicon
  575. Microstructure and Stress Aspects of Electromigration Modeling
  576. Optimizing the Performance of Carbon Nanotube Transistors
  577. Quantum Correction to the Semiclassical Electron-Phonon Scattering Operator
  578. Computational Intelligence, Bioinformatics and Computational Biology: A Brief Overview of Methods, Problems and Perspectives
  579. An advanced equation assembly module
  580. A method for generating structurally aligned grids for semiconductor device simulation
  581. Optimization of Single-Gate Carbon-Nanotube Field-Effect Transistors
  582. Quantum transport in ultra-scaled double-gate MOSFETs: A Wigner function-based Monte Carlo approach
  583. Optimization of Schottky barrier carbon nanotube field effect transistors
  584. Transient electro-thermal investigations of interconnect structures exposed to mechanical stress
  585. Separated carrier injection control in carbon nanotube field-effect transistors
  586. Modeling of Lattice Site-Dependent Incomplete Ionization in α-SiC Devices
  587. Numerical Analysis of SiC Merged PiN Schottky Diodes
  588. Numerical Simulation and Optimization for 900V 4H-SiC DiMOSFET Fabrication
  589. Nonparabolic macroscopic transport models for device simulation based on bulk Monte Carlo data
  590. Numerical Analysis of Coaxial Double Gate Schottky Barrier Carbon Nanotube Field Effect Transistors
  591. Electron Mobility Model for Strained-Si Devices
  592. Applications of Three-Dimensional Topography Simulation in the Design of Interconnect Lines
  593. Dynamic Mesh Adaptation for Three-Dimensional Electromigration Simulation
  594. Efficient Calculation of Quasi-Bound State Tunneling in CMOS Devices
  595. Modeling of Tunneling Currents for Highly Degraded CMOS Devices
  596. Monte Carlo Simulation of Ion Implantation for Doping of Strained Silicon MOSFETs
  597. Shot Noise Suppression and Enhancement at 2D Hopping and in Single-Electron Arrays
  598. Three-Dimensional Simulation of Stress Dependent Thermal Oxidation
  599. Analysis of Split-Drain MAGFETs
  600. A Non-Parabolic Six Moments Model for the Simulation of Sub-100 nm Semiconductor Devices
  601. Evolution of Current Transport Models for Engineering Applications
  602. Extraction of material parameters based on inverse modeling of three-dimensional interconnect fusing structures
  603. Unified particle approach to Wigner-Boltzmann transport in small semiconductor devices
  604. Modeling of Tunneling Current and Gate Dielectric Reliability for Nonvolatile Memory Devices
  605. Enhancement of breakdown voltage for Ni-SiC Schottky diodes utilizing field plate edge termination
  606. Statistical simulation of gate dielectric wearout, leakage, and breakdown
  607. Feature-Scale Process Simulation and Accurate Capacitance Extraction for the Backend of a 100-nm Aluminum/TEOS Process
  608. Rigorous modeling of high-speed semiconductor devices
  609. A Study on Global and Local Optimization Techniques for TCAD Analysis Tasks
  610. New SOI lateral power devices with trench oxide
  611. An algorithm for smoothing three-dimensional Monte Carlo ion implantation simulation results
  612. A quasi-particle model of the electron–Wigner potential interaction
  613. Direct extraction feature for scattering parameters of SiGe-HBTs
  614. Rigorous modeling approach to numerical simulation of SiGe HBTs
  615. The state-of-the-art in simulation for optimization of SiGe-HBTs
  616. High-voltage lateral trench gate SOI-LDMOSFETs
  617. On the simulation of the formation and dissolution of silicon self-interstitial clusters and the corresponding inverse modeling problem
  618. Analysis and Simulation of Heterostructure Devices
  619. Operator-Split Method for Variance Reduction in Stochastic Solutions of the Wigner Equation
  620. Semiclassical Approximation of Electron-Phonon Scattering Beyond Fermi's Golden Rule
  621. Solution of the Space-dependent Wigner Equation Using a Particle Model
  622. A Stable Backward Monte Carlo Method for the Solution of the Boltzmann Equation
  623. A Weight Decomposition Approach to the Sign Problem in Wigner Transport Simulations
  624. A Zero Field Monte Carlo Algorithm Accounting for the Pauli Exclusion Principle
  625. A non-parabolic six moments model for the simulation of sub-100 nm devices
  626. Accurate Modeling of Lattice Site-Dependent Ionization Level of Impurities in α-SiC Devices
  627. Advanced Transport Models for Sub-Micrometer Devices
  628. Anisotropic Laplace Refinement for Three-Dimensional Oxidation Simulation
  629. Full Three-Dimensional Analysis of a Non-Volatile Memory Cell
  630. Interconnects and Propagation of High Frequency Signals
  631. Intrinsic Point Defects, Impurities, and Their Diffusion in Silicon
  632. Monte Carlo Simulation of Ion Implantation in Silicon-Germanium Alloys
  633. On the Calculation of Quasi-Bound States and Their Impact on Direct Tunneling in CMOS Devices
  634. On the Validity of the Relaxation Time Approximation for Macroscopic Transport Models
  635. Performance Evaluation of Linear Solvers Employed for Semiconductor Device Simulation
  636. The Evolution of the Resistance and Current Density During Electromigration
  637. Three-Dimensional Analysis of Schottky Barrier Carbon Nanotube Field Effect Transistors
  638. Evolution of current transport models for engineering applications
  639. Numerical analysis of coaxial double gate Schottky barrier carbon nanotube field effect transistors
  640. A Monte Carlo Method Seamlessly Linking Quantum and Classical Transport Calculations
  641. Analysis of Gate Dielectric Stacks Using the Transmitting Boundary Method
  642. Monte Carlo method for modeling of small signal response including the Pauli exclusion principle
  643. HOT CARRIER EFFECTS WITHIN MACROSCOPIC TRANSPORT MODELS
  644. Rigorous integration of semiconductor process and device simulators
  645. Efficient inductance calculation in interconnect structures by applying the Monte Carlo method
  646. Improving SiC lateral DMOSFET reliability under high field stress
  647. Modeling of retention time degradation due to inelastic trap-assisted tunneling in EEPROM devices
  648. On smoothing three-dimensional monte carlo ion implantation simulation results
  649. Stochastic interpretation of the Wigner transport in nanostructures
  650. Simulation of void formation in interconnect lines
  651. The stationary Monte Carlo method for device simulation. I. Theory
  652. The stationary Monte Carlo method for device simulation. II. Event biasing and variance estimation
  653. Simulation of arsenic in situ doping with polysilicon cvd and its application to high aspect ratio trenches
  654. An event bias technique for Monte Carlo device simulation
  655. Monte Carlo algorithms for stationary device simulations
  656. A numerical study of partial-SOI LDMOSFETs
  657. A review of hydrodynamic and energy-transport models for semiconductor device simulation
  658. Prolog to: A review of hydrodynamic and energy-transport models for semiconductor device simulation
  659. Comparison of numerical quantum device models
  660. A multistage smoothing algorithm for coupling cellular and polygonal datastructures
  661. Abgeleitete Datentypen
  662. Ausdrücke
  663. Dateien
  664. Datenstrukturen
  665. Die Entwicklungsumgebung
  666. Dynamischer Speicher
  667. Ein exemplarisches Software-Projekt
  668. Einführung
  669. Eingabe — Ausgabe
  670. Energy transport gate current model accounting for non-Maxwellian energy distribution
  671. Error estimated driven anisotropic mesh refinement for three-dimensional diffusion simulation
  672. Erste Schritte
  673. Fehlerbehandlung
  674. Felder
  675. Funktionen
  676. Grafische Darstellungsmittel
  677. Hierarchical Device Simulation
  678. Iterationen
  679. Mobility modeling in presence of quantum effects
  680. Numerical analysis of compound semiconductor RF devices
  681. Numerik
  682. Numerische Datentypen
  683. Programmieren in C
  684. Reformulation of macroscopic transport models based on the moments of the scattering integral [semiconductor device modeling applications]
  685. Rekursive Funktionen
  686. Selektionen
  687. Speicherklassen
  688. Substrate orientation-dependence of electron mobility in strained SiGe layers
  689. Variablen, Konstanten
  690. Zeichenketten
  691. Zeiger
  692. Three-dimensional device optimization by Green's functions
  693. Simulation of hot-electron oxide tunneling current based on a non-Maxwellian electron energy distribution function
  694. Design optimization of multi-barrier tunneling devices using the transfer-matrix method
  695. Revision of the standard hydrodynamic transport model for SOI simulation
  696. Simulative prediction of the resistance change due to electromigration induced void evolution
  697. A Wigner equation with quantum electron–phonon interaction
  698. Characterization of the hot electron distribution function using six moments
  699. Femtosecond relaxation of hot electrons by phonon emission in presence of electric field
  700. Accurate impact ionization model which accounts for hot and cold carrier populations
  701. Transient model for terminal current noise
  702. An extensible TCAD optimization framework combining gradient based and genetic optimizers
  703. Effects of Stress-Induced Bandgap Narrowing on Reverse-Bias Junction Behavior
  704. Lateral Trench Gate Super-Junction SOI-LDMOSFETs with Low On-Resistance
  705. On Increasing the Accuracy of Simulations of Deposition and Etching Processes Using Radiosity and the Level Set Method
  706. Technology CAD: Device simulation and characterization
  707. Three-Dimensional Analysis of a MAGFET at 300 K and 77 K
  708. Influence of the distribution function shape and the band structure on impact ionization modeling
  709. Effectiveness of silicon nitride passivation in III-V based heterojunction bipolar transistors
  710. Simulation of ferroelectric thin films
  711. Micro materials modeling in MINIMOS-NT
  712. Investigation of spurious velocity overshoot using Monte Carlo data
  713. Using six moments of Boltzmann’s transport equation for device simulation
  714. Industrial application of heterostructure device simulation
  715. Fully coupled electrothermal mixed-mode device simulation of SiGe HBT circuits
  716. Simulation of power heterojunction bipolar transistors on gallium arsenide
  717. Influence of generation/recombination effects in simulations of partially depleted SOI MOSFETs
  718. A finite element simulator for three-dimensional analysis of interconnect structures
  719. Nonlinear electronic transport and device performance of HEMTs
  720. A Backward Monte Carlo Method for Simulation of the Electron Quantum Kinetics in Semiconductors
  721. A Comparative Study Of Two Numerical Techniques For Inductance Calculation In Interconnect Structures
  722. A Methodology for Deep Sub-Quartermicron CMOS Technology Characterization
  723. A Review of Modeling Issues for RF Heterostructure Device Simulation
  724. A methodology for deep sub-0.25 μm CMOS technology prediction
  725. Accurate Simulation of Substrate Currents by Accounting for the Hot Electron Tail Population
  726. Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation
  727. An Impact Ionization Model Including Non-Maxwellian And Non-Parabolicity Effects
  728. Analysis of Ultra Short MOSFETs with High-k Gate Dielectrics
  729. Boundary Condition Models for Terminal Current Fluctuations
  730. Computational Single-Electronics
  731. Green’s Function Approach for Three-Dimensional Diffusion Simulation of Industrial High Voltage Applications
  732. Investigation of Spurious Velocity Overshoot Using Monte Carlo Data
  733. Monitoring Arsenic In-Situ Doping with Advanced Models for Poly-Silicon CVD
  734. Monte Carlo Analysis of the Small-Signal Response of Charge Carriers
  735. Optimization for TCAD Purposes Using Bernstein Polynomials
  736. Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation
  737. TCAD Analysis of Gain Cell Retention Time for SRAM Applications
  738. Two-dimensional simulation of ferroelectric memory cells
  739. Variance and Covariance Estimation in Stationary Monte Carlo Device Simulation
  740. Mixed-mode device simulation
  741. Extensible TCAD optimization framework combining gradient-based and genetic optimizers
  742. Hydrodynamic modeling of avalanche breakdown in a gate overvoltage protection structure
  743. Three-dimensional resist development simulation — Benchmarks and integration with lithography
  744. A Monte Carlo method for small signal analysis of the Boltzmann equation
  745. Parallelization of a Monte Carlo ion implantation simulator
  746. A temperature dependent model for the saturation velocity in semiconductor materials
  747. A Global Self-Heating Model for Device Simulation
  748. Analysis of HBT behavior after strong electrothermal stress
  749. Development of global calibration for accurate GaAs-PHEMT simulation
  750. Incorporation of Equipment Simulation into Integrated Feature Scale Profile Evolution
  751. On the interplay between meshing and discretization in three-dimensional diffusion simulation
  752. Simulation of InAlAs/InGaAs high electron mobility transistors with a single set of physical parameters
  753. Simulation of Polysilicon Emitter Bipolar Transistors
  754. Simulation of gallium-arsenide based high electron mobility transistors
  755. Theory of the Monte Carlo method for semiconductor device simulation
  756. Study of dopant-dependent band gap narrowing in compound semiconductor devices
  757. Aktuelle Entwicklungen der Mikroelektronik
  758. An energy relaxation time model for device simulation
  759. Two-Dimensional Simulation of Ferroelectric Memory Cells
  760. Comment on “Influence of the doping element on the electron mobility in n silicon” [J. Appl. Phys. 83, 3096 (1998)]
  761. Response to “Comment on ‘Influence of the doping element on the electron mobility in n-silicon’ ” [J. Appl. Phys. 85, 7984 (1999)]
  762. VLSI performance metric based on minimum TCAD simulations
  763. Drive performance of an asymmetric MOSFET structure: the peak device
  764. A computationally efficient method for three-dimensional simulation of ion implantation
  765. Advanced Models, Applications, and Software Systems for High Performance Computing — Application in Microelectronics
  766. Microtransducer CAD
  767. Simulation of complete VLSI fabrication processes with heterogeneous simulation tools
  768. Linear gate assignment: a fast statistical mechanics approach
  769. Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation
  770. Monte Carlo simulation of silicon amorphization during ion implantation
  771. Abstracts of Manuscripts in The Journal of Technology Computer Aided Design (TCAD)
  772. An interpolation based MOSFET model for low-voltage applications
  773. Die großen Herausforderungen in der Mikroelektronik in den nächsten zehn Jahren
  774. Mixed-element decomposition method for three-dimensional grid adaptation
  775. Three-dimensional photolithography simulator including rigorous nonplanar exposure simulation for off-axis illumination
  776. Implications of dopant-dependent low-field mobility and band gap narrowing on the bipolar device performance
  777. Influence of the doping element on the electron mobility in n-silicon
  778. Single-Electron Memories
  779. A CMOS IC for portable EEG acquisition systems
  780. A Dopant-Dependent Band Gap Narrowing Model Application for Bipolar Device Simulation
  781. A Physically-Based Electron Mobility Model for Silicon Device Simulation
  782. A Qualitative Study on Optimized MOSFET Doping Profiles
  783. A comparative study of single-electron memories
  784. Accurate Layout-Based Interconnect Analysis
  785. Advanced Physical Models for Silicon Device Simulation
  786. Device Simulator Calibration for Quartermicron CMOS Devices
  787. Efficient Algorithms for Three-Dimensional Etching and Deposition Simulation
  788. High-precision interconnect analysis
  789. Hydrodynamic Mixed-Mode Simulation
  790. Integrated optimization capabilities in the VISTA technology CAD framework
  791. Parallel and Distributed TCAD Simulations using Dynamic Load Balancing
  792. Rigorous Capacitance Simulation of DRAM Cells
  793. Simulation of AVC Measurements
  794. Three-Dimensional Adaptive Mesh Relaxation
  795. Two-Dimensional Simulation of Ferroelectric Nonvolatile Memory Cells
  796. Influence of Dopant Species on Electron Mobility in Heavily Doped Semiconductors
  797. Physical models for strained and relaxed GaInAs alloys: Band structure and low-field transport
  798. Simulation of submicron double-heterojunction high electron mobility transistors with MINIMOS-NT
  799. Rundschau
  800. Influence of backside doping on the nonlinear capacitances of a PHEMT affecting the VCO frequency characteristics
  801. Optimization of pseudomorphic HEMT's supported by numerical simulations
  802. Rigorous three-dimensional photoresist exposure and development simulation over nonplanar topography
  803. SIMON-A simulator for single-electron tunnel devices and circuits
  804. On the lower bounds of CMOS supply voltage
  805. Two-dimensional dopant profiling of submicron metal–oxide–semiconductor field-effect transistor using nonlinear least squares inverse modeling
  806. A single-electron device and circuit simulator with a new algorithm to incorporate co-tunneling
  807. AMIGOS: Analytical model interface & general object-oriented solver
  808. Fully unstructured Delaunay mesh generation using a modified advancing front approach for applications in technology cad
  809. High-level TCAD task representation and automation
  810. Monte Carlo simulation of silicon amorphization during ion implantation
  811. Optimized algorithms for three-dimensional cellular topography simulation
  812. Three-dimensional photolithography simulation
  813. VLSI performance metric based on minimum TCAD simulations
  814. Device structures and device simulation techniques
  815. Trajectory split method for Monte Carlo simulation of ion implantation
  816. Process simulation for the 1990s
  817. Device modelling for the 1990s
  818. The Viennese integrated system for technology CAD applications
  819. 3D TCAD at TU Vienna
  820. A Monte Carlo Transport Model Based on Spherical Harmonics Expansion of the Valence Bands
  821. A Programmable Tool for Interactive Wafer-State Level Data Processing
  822. Algorithms and models for cellular based topography simulation
  823. An advanced model for dopant diffusion in polysilicon
  824. Analytical Model for Phosphorus Large Angle Tilted Implantation
  825. Polygonal Geometry Reconstruction after Cellular Etching or Deposition Simulation
  826. Statistical Accuracy and CPU Time Characteristic of Three Trajectory Split Methods for Monte Carlo Simulation of Ion Implantation
  827. TCAD Optimization Based on Task-Level Framework Services
  828. The extraction of two-dimensional MOS transistor doping via inverse modeling
  829. The Simulation System for Three-Dimensional Capacitance and Current Density Calculation with a User Friendly GUI
  830. Three-Dimensional Grid Adaptation Using a Mixed-Element Decomposition Method
  831. Two-dimensional simulation of thermal runaway in a nonplanar GTO-thyristor
  832. Two-Dimensional Transient Simulation of Charge-Coupled Devices Using MINIMOS NT
  833. VISTA-user interface, task level, and tool integration
  834. A comparison of numerical solutions of the Boltzmann transport equation for high-energy electron transport silicon
  835. A hybrid device simulator that combines Monte Carlo and drift-diffusion analysis
  836. Modelling of Interface Carrier Transport for Device Simulation
  837. VISTA-the data level
  838. Finite difference, boundary-fitted grid generation for arbitrarily shaped two-dimensional simulation areas
  839. A General Simulation Method for Etching and Deposition Processes
  840. Analysis of a CMOS-Compatible Vertical Bipolar Transistor
  841. Electron Transport in Silicon Dioxide at Intermediate and High Electric Fields
  842. Evaluation of Effective Device Parameters by Comparison of Measured and Simulated C-V Characteristics for Conventional and Pseudomorphic HEMTs
  843. MOSFET Models for VLSI Circuit Simulation
  844. Multigrid Methods for Process Simulation
  845. Practical Use of a Hierarchical Linear Solver Concept for 3D MOS Device Simulation
  846. Process Flow Representation within the VISTA Framework
  847. Simulation of Semiconductor Devices and Processes
  848. Technology CAD Systems
  849. The Viennese Integrated System for Technology CAD Applications
  850. Analysis of geometric charge-pumping components in a thin-film SOI device
  851. Transient two-dimensional numerical analysis of the charge-pumping experiment
  852. Fast Iterative Solution of Carrier Continuity Equations for Three-Dimensional Device Simulation
  853. Calculation of contact currents in device simulation
  854. Two-dimensional numerical modeling of interband tunneling accounting for nonuniform electric field
  855. A new open technology CAD system
  856. Monte-Carlo — Poisson coupling using transport coefficients
  857. On the numerical solution of the three-dimensional semiconductor device equations on vector-concurrent computers
  858. Self-adaptive space and time grids in device simulation
  859. Device modeling and physics
  860. The Drift Diffusion Equation and Its Applications in MOSFET Modeling
  861. Three-dimensional simulation of semiconductor devices on supercomputers
  862. Coupling of Monte Carlo and Drift Diffusion Method with Applications to Metal Oxide Semiconductor Field Effect Transistors
  863. On the effect of non-degenerate doping of polysilicon gate in thin oxide MOS-devices—Analytical modeling
  864. The evolution of the MINIMOS mobility model
  865. BAMBI — A transient 2D-MESFET model with general boundary conditions including Schottky and current controlled contacts
  866. Compact Transistor Modelling for Circuit Design
  867. Numerical treatment of nonrectangular field-oxide for 3-D MOSFET simulation
  868. Three-dimensional effects due to the field oxide in MOS devices analyzed with MINIMOS 5
  869. Two-dimensional transient simulation of the turn-off behavior of a planar MOS-transistor
  870. Computer simulations of Schottky contacts with a non-constant recombination velocity
  871. Process modeling
  872. Monte Carlo simulation of ion implantation into two- and three-dimensional structures
  873. Three-dimensional process and device modeling
  874. MESFET Analysis with MINIMOS
  875. MOS device modeling at 77 K
  876. Physical Models for Silicon VLSI
  877. The Monte Carlo Method for Semiconductor Device Simulation
  878. 3D MOSFET DEVICE EFFECTS DUE TO FIELD OXIDE
  879. ON-RESISTANCE IN THE ALDMOST
  880. MOS device modeling at liquid-nitrogen temperature
  881. Two-dimensional modeling of ion implantation induced point defects
  882. MINIMOS 3: A MOSFET simulator that includes energy balance
  883. Two-dimensional modeling of ion implantation with spatial moments
  884. A NEW MODEL FOR THE DETERMINATION OF POINT DEFECT EQUILIBRIUM CONCENTRATIONS IN SILICON
  885. Die Erweiterung von MINIMOS auf ein 3D Simulationsprogramm
  886. Efficient two-dimensional Monte Carlo simulation of ion implantation
  887. The extension of MINIMOS to a three dimensional simulation program
  888. Zwei-Dimensionale Transiente Simulation des Einschaltverhaltens eines Planaren MOS-Transistors
  889. Two-Dimensional Green's Function of a Semi-Infinite Anisotropic Dielectric in the Wavenumber Domain
  890. Rigorous 3D Electrostatic Field Analysis of SAW Transducers with Closed-Form Formulae
  891. The Stationary Semiconductor Device Equations
  892. Process and device modelling for VLSI
  893. Simulation of Critical IC-Fabrication Steps
  894. Simulation of critical IC-fabrication steps
  895. Two-dimensional coupled diffusion modeling
  896. Simulation of Critical IC Fabrication Processes Using Advanced Physical and Numerical Methods
  897. Simulation of critical IC fabrication processes using advanced physical and numerical methods
  898. Zweidimensionale Prozessimulation
  899. Beihefte zur Zeitschrift für romanische Philologie
  900. Beihefte zur Zeitschrift für romanische Philologie
  901. Beihefte zur Zeitschrift für romanische Philologie 192
  902. Temperature distribution and power dissipation in MOSFETs
  903. ON MODELING THE INTRINSIC NUMBER AND FERMI LEVELS FOR DEVICE AND PROCESS SIMULATION
  904. Implications of Analytical Investigations About the Semiconductor Equations on Device Modeling Programs
  905. A Glimpse on Results
  906. Analysis and Simulation of Semiconductor Devices
  907. Analytical Investigations About the Basic Semiconductor Equations
  908. Introduction
  909. JANAP — Ein Programm Zur Simulation Des Zeitverhaltens Von Nichtlinearen Elektrischen Schaltungen
  910. Numerische Simulation Von Halbleiterbauelementen
  911. On the Calculation of Charge, Electrostatic Potential and Capacitance in Generalized Finite SAW Structures
  912. Process Modeling
  913. Process and device modeling for VISI
  914. Some Fundamental Properties
  915. The Discretization of the Basic Semiconductor Equations
  916. The Physical Parameters
  917. The Solution of Sparse Systems of Linear Equations
  918. The Solution of Systems of Nonlinear Algebraic Equations
  919. A novel finite-element approach to device modeling
  920. A singular perturbation approach for the analysis of the fundamental semiconductor equations
  921. Finite boxes—A generalization of the finite-difference method suitable for semiconductor device simulation
  922. Numerical analysis of acoustic wave generation in anisotropic piezoelectric materials
  923. Modeling static and dynamic behavior of power devices
  924. Surface and Bulk Wave Velocities in Arbitrary Anisotropic Piezoelectric Materials
  925. Atlas, matrices et similarités: Petit aperçu dialectométrique
  926. A numerical analysis of bulk-barrier diodes
  927. Analysis of Breakdown Phenomena in MOSFET's
  928. A two-dimensional model of the avalanche effects in MOS transistors
  929. Investigation of parameter sensitivity of short channel mosfets
  930. Numerical Analysis of Acoustic Wave Generation in Anisotropic Piezoelectric Materials
  931. Simple and accurate representation of implantation parameters by low order polynomals
  932. MINIMOS - A Two-Dimensional MOS Transistor Analyzer
  933. MINIMOS—A two-dimensional MOS transistor analyzer
  934. Current Transport in Nanoelectronic Semiconductor Devices
  935. Modeling Current Transport in Ultra-Scaled Field Effect Transistors
  936. Optimization Issue in Interconnect Analysis
  937. Impact of NBTI-Driven Parameter Degradation on Lifetime of a 90nm p-MOSFET
  938. Improving DC and AC characteristics of ohmic contact carbon nanotube field effect transistors
  939. Inverse modeling of oxid deposition using measurements of a TEOS CVD process
  940. The effect of device geometry on the static and dynamic response of carbon nanotube field effect transistors
  941. Tunneling and intersubband coupling in ultra-thin body double-gate mosfets
  942. A comparison of quantum correction models for the three-dimensional simulation of FinFET structures
  943. Numerical simulation of selected semiconductor devices
  944. Three-dimensional topography simulation based on a level set method [deposition and etching processes]
  945. A method for generating structurally aligned high quality grids and its application to the simulation of a trench gate MOSFET
  946. Evaluation of ZrO/sub 2/ gate dielectrics for advanced CMOS devices
  947. From feature scale simulation to backend simulation for a 100 nm CMOS process
  948. Optimization of electrothermal material parameters using inverse modeling [polysilicon fuse interconnects]
  949. Rigorous modeling of high-speed semiconductor devices
  950. Silicon carbide accumulation-mode laterally diffused MOSFET
  951. Simulation of carrier transport in carbon nanotube field effect transistors
  952. Simulation of thermal oxidation: a three-dimensional finite element approach
  953. A calibrated model for silicon self-interstitial cluster formation and dissolution
  954. A new gate current model accounting for a non-Maxwellian electron energy distribution function
  955. A strategy to enforce the discrete minimax principle on finite element meshes
  956. An adaptive grid approach for the simulation of electromigration induced void migration
  957. Electromigration induced evolution of voids in current crowding areas of interconnects
  958. Enhanced advancing front Delaunay meshing in TCAD
  959. Investigation of the electron mobility in strained Si/sub 1-x/Ge/sub x/ at high Ge composition
  960. Macro-modeling for MOS device simulation
  961. Recent advances in transport modeling for miniaturized CMOS devices
  962. Simulation and inverse modeling of TEOS deposition processes using a fast level set method
  963. Simulation of a "Well Tempered" SOI MOSFET using an enhanced hydrodynamic transport model
  964. Small-signal analysis and direct S-parameter extraction
  965. Wigner transport through tunneling structures scattering interpretation of the potential operator
  966. A Wigner equation for the nanometer and femtosecond transport regime
  967. Design optimization of multi-barrier tunneling devices using the transfer-matrix method
  968. Numerical study of partial-SOI LDMOSFET power devices
  969. Reliable prediction of deep sub-quarter micron CMOS technology performance
  970. Mixed-mode device simulation
  971. Practical inverse modeling with SIESTA
  972. Thermal models for semiconductor device simulation
  973. SAP-a program package for three-dimensional interconnect simulation
  974. AMIGOS: analytical model interface and general object-oriented solver
  975. VLSI performance metric based on minimum TCAD simulations
  976. Two Dimensional Simulation of Thermal Runaway in a Nonplanar GTO-Thyristor
  977. A High Performance Generic Scientific Simulation Environment
  978. A Monte Carlo MOSFET simulator based on a new method for the Poisson-transport iteration
  979. A New Method For Simulation Of Etching And Deposition Processes
  980. A consistent dynamic MOSFET model for low-voltage applications
  981. A method for unified treatment of interface conditions suitable for device simulation
  982. A new approach to fully unstructured three-dimensional Delaunay mesh generation with improved element quality
  983. A new approach to ionized-impurity scattering
  984. A novel method for extracting the two-dimensional doping profile of a sub-half micron MOSFET
  985. Adaptive Grid for Monte Carlo Simulation of Ion Implantation
  986. Adaptive tessellation for the three-dimensional simulation of doping profiles
  987. An integrated technology CAD environment
  988. Analysis of high speed heterostructure devices
  989. Capacitance Calculation Of VLSI Multilevel Wiring Structures
  990. Comparison of finite element and finite box discretization for three-dimensional diffusion modeling using AMIGOS
  991. Comprehensive analysis of vacancy dynamics due to electromigration
  992. Connection of Network and Device Simulation
  993. Consistent User Interface and Task Level Architecture of a TCAD System
  994. Consistent comparison of drift-diffusion and hydro-dynamic device simulations
  995. Dynamic grain-growth and static clustering effects on dopant diffusion in polysilicon
  996. Efficient Coupling of Monte Carlo and Level Set Methods for Topography Simulation
  997. Electro-thermal effects in mixed-mode device simulation
  998. Electrothermai Analysis Oflatch-up In An IGT

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