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  1. Effect of casting moulds on grain morphology, mechanical and tribological properties of Sn–Cu alloy

    Article • Bulletin of Materials Science, March 2025, Springer Science + Business Media

    Dr Satyanarayan .

  2. Experimental Analysis of Stability of Copper Oxide (CuO) Nanofluids Using Sedimentation Method

    Article • January 2025, Springer Science + Business Media

    Dr Satyanarayan .

  3. Characterization and thermal performance of Sn-Bi alloy used as a thermal interface material

    Article • January 2025, Materials Research Forum, LLC

    Dr Satyanarayan .

  4. Lead-free solders for high-temperature applications

    Article • January 2025, Materials Research Forum, LLC

    Dr Satyanarayan .

  5. Implosive reactive armour to enhance explosive welding on hard surfaces in modern warfare

    Article • January 2025, Materials Research Forum, LLC

    Dr Satyanarayan .

  6. Optimization of process parameters in explosive welding using machine learning

    Article • January 2025, Materials Research Forum, LLC

    Dr Satyanarayan .

  7. Effect of heat treatment on mechanical and wear properties of aluminum tin (Pb free) bearing material

    Article • January 2025, Materials Research Forum, LLC

    Dr Satyanarayan .

  8. The effect of interfacial morphology and weldability window on tin and aluminum plates welded using regulated water shockwaves

    Article • Welding in the World, September 2024, Springer Science + Business Media

    Dr Satyanarayan .

  9. A review on optimum substrate surface roughness to create better wetting

    Article • Materials Open Research, February 2024, Faculty of 1000, Ltd.

    Dr Satyanarayan .

  10. Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

    Article • Materials Science Forum, September 2015, Trans Tech Publications

    Dr Satyanarayan .

  11. Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

    Article • Materials Science and Technology, November 2013, Taylor & Francis

    Dr Satyanarayan .

  12. Spreading Behavior and Evolution of IMCs During Reactive Wetting of SAC Solders on Smooth and Rough Copper Substrates

    Article • Journal of Electronic Materials, June 2013, Springer Science + Business Media

    Dr Satyanarayan .

  13. Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutions

    Article • Journal of Dentistry, June 2013, Elsevier

    Dr Satyanarayan .

  14. Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

    Article • Materials Science and Technology, April 2013, Taylor & Francis

    Dr Satyanarayan .

  15. Wetting behavior of lead-free solders on copper substrates

    Article • January 2013, the Institution of Engineering and Technology (the IET)

    Dr Satyanarayan .

  16. Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn–0.7Cu solder alloy and copper substrate

    Article • Journal of Materials Science Materials in Electronics, February 2012, Springer Science + Business Media

    Dr Satyanarayan .

  17. Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

    Article • Materials Science and Engineering A, January 2012, Elsevier

    Dr Satyanarayan .

  18. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

    Article • Advances in Colloid and Interface Science, August 2011, Elsevier

    Dr Satyanarayan .

  19. Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates

    Article • Materials Science and Technology, July 2011, Taylor & Francis

    Dr Satyanarayan .

  20. Wetting Behaviour and Evolution of Microstructure of Sn–Ag–Zn Solders on Copper Substrates with Different Surface Textures

    Article • Journal of ASTM International, January 2010, ASTM International

    Dr Satyanarayan .

  21. Wetting Behaviour and Evolution of Microstructure of Sn-Ag-Zn Solders on Copper Substrates with Different Surface Textures

    Article • ASTM International

    Dr Satyanarayan .