All Stories

  1. Adaptive HTF-MPR
  2. An Output Selection Strategy for Network-on-Chip Systems (DICA)
  3. System-Level Analysis of 3D ICs with Thermal TSVs
  4. Novel CNFET Ternary Circuit Techniques for High-performance and Energy-efficient Design
  5. Reducing bypass-based network-on-chip latency using priority mechanism
  6. A novel method for designing ternary adder cell based on CNFETs
  7. Computer Architecture
  8. Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC