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  1. Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics

    Article • Microelectronics Reliability, November 2017, Elsevier

    muhammad aamir

  2. Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

    Article • Soldering & Surface Mount Technology, September 2017, Emerald

    muhammad aamir