All Stories

  1. Neutron diffraction analysis of dislocation behaviour and substructures of Si-alloyed and interstitial-free BCC steels
  2. Effects of Cooling Rate During Solid Solution Treatment on Precipitation Behavior and Hardness in Ni–38Cr–3.8Al Alloys
  3. 大きな磁歪を示す鉄合金を搭載したデバイスの振動におけるひずみや磁界の変化
  4. Effect of work-hardening on the relationship between compressive strength and hardness of quenched medium carbon steel
  5. Characterization of Dislocation Structure by Line Profile Analysis Using X-rays and Neutrons
  6. Structure restoration and coarsening of nanocrystalline cementite in cold drawn pearlitic wire induced by low temperature annealing
  7. In situ neutron diffraction analysis of microstructural evolution-dependent stress response in austenitic stainless steel under cyclic plastic deformation
  8. A modified pearlite microstructure to overcome the strength-plasticity trade-off of heavily drawn pearlitic wire
  9. Impact of Dislocation Density and Mobility on Yielding Behavior in Quenched Medium-carbon Martensitic Steel Tempered at Low Temperature
  10. In situ diffraction characterization on microstructure evolution in austenitic stainless steel during cyclic plastic deformation and its relation to the mechanical response
  11. Depth-profiling of residual stress and microstructure for austenitic stainless steel surface treated by cavitation, shot and laser peening
  12. Variation of tensile strength and elastic limit due to tempering at low temperature on quenched medium carbon steel
  13. Inhomogeneous strain and recrystallisation of a shot-peened Inconel 625 alloy after annealing
  14. Tuning strain-induced γ-to-ε martensitic transformation of biomedical Co–Cr–Mo alloys by introducing parent phase lattice defects
  15. Evaluation of Microstructural Characteristics in Low-Cycle Fatigued Austenitic Stainless Steel Using X-Ray Line Profile Analysis
  16. Report of THERMEC’2018
  17. X-rays, Laser, X-rays again
  18. Determination Approach of Dislocation Density and Crystallite Size Using a Convolutional Multiple Whole Profile Software
  19. In-situ Observation of Dislocation Evolution in Ferritic and Austenitic Stainless Steels under Tensile Deformation by Using Neutron Diffraction
  20. Development of On-site Measurement Technique of Retained Austenite Volume Fraction by Compact Neutron Source RANS
  21. Microscopic Residual Stress Distribution Measurement on the Single Dent Surface Assuming Shot Peening
  22. Residual stress variation due to shot peening and thermal ageing on welded Ni-alloy pipe
  23. Prospect for application of compact accelerator-based neutron source to neutron engineering diffraction
  24. Non-destructive Texture Measurement of Steel Sheets with Compact Neutron Source “RANS”
  25. Texture evaluation in ductile fracture process by neutron diffraction measurement
  26. Strengthening of biomedical Ni-free Co–Cr–Mo alloy by multipass “low-strain-per-pass” thermomechanical processing
  27. Distribution and Anisotropy of Dislocations in Cold-drawn Pearlitic Steel Wires Analyzed Using Micro-beam X-ray Diffraction
  28. Residual Stress Analysis of Cold-drawn Pearlite Steel Wire Using White Synchrotron Radiation
  29. X-Ray Line Profile Study on Shot/Laser-Peened Stainless Steel
  30. Workhardening and the microstructural characteristics of shot- and laser-peened austenitic stainless steel
  31. Microstructural Features of Cold-Rolled Carbon Steel Evaluated by X-ray Diffraction Line Profile Analysis and Their Correlation with Mechanical Properties
  32. X-ray diffraction study on microstructures of shot/laser-peened AISI316 stainless steel
  33. Relationship between dislocations and residual stresses in cold-drawn pearlitic steel analyzed by energy-dispersive X-ray diffraction
  34. Evaluation of Microstructures and Mechanical Properties of Steel with Tensile Loading Process Using X-Ray Line Profile Analysis
  35. Analysis of Crack Propagation in Stealth Dicing Using Stress Intensity Factor(M & M 2009 Conference)
  36. Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer
  37. Internal Modification of Ultra Thin Silicon Wafer by Permeable Pulse Laser
  38. Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing
  39. Laser processing of doped silicon wafer by the Stealth Dicing
  40. Advanced dicing technology for semiconductor wafer -Stealth Dicing